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Patent
D761745
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Priority
Jun 28 2013
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Filed
Dec 17 2013
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Issued
Jul 19 2016
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Expiry
Jul 19 2030
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Assg.orig
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Entity
unknown
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10
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39
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n/a
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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a cross sectional view taken along line 7-7 of FIG. 1 thereof;
FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 1 thereof; and,
FIG. 9 is a perspective view thereof.
Shinkai, Jiro
| Patent |
Priority |
Assignee |
Title |
| 10383240, |
Jun 13 2017 |
Honeywell International Inc. |
Housing to retain integrated circuit package |
| 10718640, |
May 03 2016 |
Continental Automotive Technologies GmbH |
Sensor element for a motor vehicle |
| D778850, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D778851, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D778852, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D784937, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D785576, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D786810, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D893438, |
Aug 21 2017 |
Tokyo Electron Limited |
Wafer boat |
| ER8020, |
|
|
|
| Patent |
Priority |
Assignee |
Title |
| 2789344, |
|
|
|
| 3579859, |
|
|
|
| 20020027762, |
|
|
|
| 20020066693, |
|
|
|
| 20070086189, |
|
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|
| D273582, |
Sep 08 1981 |
|
Holding pallet for PC boards |
| D273860, |
Sep 08 1981 |
|
Holding pallet for PC boards |
| D390833, |
Sep 09 1996 |
Fujikura Ltd. |
Piezolectric conversion type semiconductor device |
| D436085, |
Jun 18 1999 |
Fujikura Ltd |
Piezoelectric conversion type semiconductor device |
| D471167, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit board |
| D493152, |
Nov 27 2002 |
LENOVO INTERNATIONAL LIMITED |
Server blade chassis midplane printed circuit board with cover |
| D522471, |
May 27 2005 |
Danville Automation Holdings LLC |
Funnel plate |
| D526972, |
Oct 14 2004 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
| D540272, |
Apr 18 2005 |
Murata Manufacturing Co., Ltd. |
Semiconductor module |
| D554084, |
Oct 31 2005 |
Kabushiki Kaisha Toshiba |
Portion of a semiconductor apparatus mounting-position accuracy measurement jig |
| D570307, |
Nov 30 2006 |
Kabushiki Kaisha Toshiba |
Portion of a printed circuit board |
| D576577, |
Nov 30 2006 |
Kabushiki Kaisha Toshiba |
Portion of a printed circuit board |
| D579885, |
Feb 20 2007 |
Tokyo Electron Limited |
Upper heat insulating cylinder for manufacturing semiconductor wafers |
| D616395, |
Mar 11 2009 |
Tokyo Electron Limited |
Support of wafer boat for manufacturing semiconductor wafers |
| D621804, |
Aug 07 2009 |
Hon Hai Precision Industry Co., Ltd. |
PCB for arranging LED lights |
| D674759, |
Aug 19 2010 |
EPISTAR CORPORATION |
Wafer carrier |
| 68316, |
|
|
|
| D687788, |
Jan 20 2012 |
Lextar Electronics Corp. |
Light emitting diode module |
| D692843, |
May 02 2012 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
| D695241, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
| D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
| D699693, |
Oct 03 2012 |
FUJI ELECTRIC CO , LTD |
Semiconductor device |
| D701843, |
Dec 28 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
| D704155, |
Feb 18 2011 |
EPISTAR CORPORATION |
Wafer carrier |
| D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
| D712853, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
| D721047, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
| D721048, |
Jun 17 2013 |
FUJI ELECTRIC CO , LTD |
Semiconductor module |
| D721340, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
| D724554, |
Feb 19 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
| D730304, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D731990, |
Apr 18 2012 |
NOK Corporation |
Integrated circuit tag |
| D737229, |
Dec 28 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
| D737230, |
Dec 28 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a