Patent
   D761745
Priority
Jun 28 2013
Filed
Dec 17 2013
Issued
Jul 19 2016
Expiry
Jul 19 2030
Assg.orig
Entity
unknown
10
39
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front view of a semiconductor device showing my new design;

FIG. 2 is rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a cross sectional view taken along line 7-7 of FIG. 1 thereof;

FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 1 thereof; and,

FIG. 9 is a perspective view thereof.

Shinkai, Jiro

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D784937, Nov 13 2014 Tokyo Electron Limited Dummy wafer
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D893438, Aug 21 2017 Tokyo Electron Limited Wafer boat
ER8020,
Patent Priority Assignee Title
2789344,
3579859,
20020027762,
20020066693,
20070086189,
D273582, Sep 08 1981 Holding pallet for PC boards
D273860, Sep 08 1981 Holding pallet for PC boards
D390833, Sep 09 1996 Fujikura Ltd. Piezolectric conversion type semiconductor device
D436085, Jun 18 1999 Fujikura Ltd Piezoelectric conversion type semiconductor device
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D493152, Nov 27 2002 LENOVO INTERNATIONAL LIMITED Server blade chassis midplane printed circuit board with cover
D522471, May 27 2005 Danville Automation Holdings LLC Funnel plate
D526972, Oct 14 2004 Toshiba Lighting & Technology Corporation Light emitting diode module
D540272, Apr 18 2005 Murata Manufacturing Co., Ltd. Semiconductor module
D554084, Oct 31 2005 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
D570307, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D576577, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D579885, Feb 20 2007 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
D616395, Mar 11 2009 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
D621804, Aug 07 2009 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
D674759, Aug 19 2010 EPISTAR CORPORATION Wafer carrier
68316,
D687788, Jan 20 2012 Lextar Electronics Corp. Light emitting diode module
D692843, May 02 2012 Sumitomo Electric Industries, Ltd. Semiconductor device
D695241, Mar 20 2012 Veeco Instruments INC Wafer carrier having pockets
D699201, Oct 01 2012 TELIT CINTERION DEUTSCHLAND GMBH Pad arrangement of a circuit module
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
D701843, Dec 28 2010 Sumitomo Electric Industries, Ltd. Semiconductor device
D704155, Feb 18 2011 EPISTAR CORPORATION Wafer carrier
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D712853, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D721047, Mar 07 2013 Vicor Corporation Semiconductor device
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D721340, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D724554, Feb 19 2014 Fuji Electric Co., Ltd. Semiconductor module
D730304, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D731990, Apr 18 2012 NOK Corporation Integrated circuit tag
D737229, Dec 28 2010 Sumitomo Electric Industries, Ltd. Semiconductor device
D737230, Dec 28 2010 Sumitomo Electric Industries, Ltd. Semiconductor device
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Dec 12 2013SHINKAI, JIROSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0318010401 pdf
Dec 17 2013Sumitomo Electric Industries, Ltd.(assignment on the face of the patent)
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