FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design.
Matsumoto, Manabu, Ozawa, Isao
Patent |
Priority |
Assignee |
Title |
10070176, |
Mar 13 2013 |
NAGRASTAR, LLC |
Systems and methods for performing transport I/O |
10382816, |
Mar 13 2013 |
NAGRASTAR, LLC |
Systems and methods for performing transport I/O |
D787456, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D787457, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D793973, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D798251, |
Nov 07 2016 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory |
D821987, |
Apr 27 2016 |
NGK Insulators, Ltd. |
Flexible printed circuits |
D825499, |
Sep 29 2016 |
Nichia Corporation |
Light emitting diode package |
D830348, |
Sep 26 2013 |
Murata Manufacturing Co., Ltd. |
Wireless transmission/reception module |
D831009, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
D840404, |
Mar 13 2013 |
NAGRASTAR, LLC |
Smart card interface |
D843334, |
May 11 2016 |
NGK Insulators, Ltd. |
Flexible printed circuits |
D843957, |
Sep 29 2016 |
Nichia Corporation |
Light emitting diode package |
D864968, |
Apr 30 2015 |
NAGRASTAR, LLC |
Smart card interface |
D886751, |
Sep 29 2016 |
Nichia Corporation |
Light emitting diode module |
D892774, |
Sep 26 2013 |
Murata Manufacturing Co., Ltd. |
Wireless transmission/reception module |
D904355, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
D942974, |
Nov 20 2018 |
THALES DIS AIS DEUTSCHLAND GMBH |
Cellular module |
ER1930, |
|
|
|
Patent |
Priority |
Assignee |
Title |
5858481, |
Jan 30 1996 |
Matsushita Electric Industrial Co., Ltd. |
Electronic circuit substrate |
6410355, |
Jun 11 1998 |
SanDisk Technologies LLC |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
7306161, |
Jul 17 2003 |
SanDisk Technologies LLC |
Memory card with chamfer |
7307848, |
Jul 17 2003 |
SanDisk Technologies LLC |
Memory card with raised portion |
7864540, |
Jul 17 2003 |
SanDisk Technologies LLC |
Peripheral card with sloped edges |
20030094628, |
|
|
|
20060168721, |
|
|
|
20080123318, |
|
|
|
20100326710, |
|
|
|
20110051351, |
|
|
|
CN488834, |
|
|
|
D459706, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit device |
D471524, |
Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit device |
D526972, |
Oct 14 2004 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
D531139, |
Oct 14 2004 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
D608741, |
Mar 13 2008 |
Panasonic Corporation |
Substrate for electric circuit |
D633672, |
Feb 10 2010 |
The Libman Company |
Pad |
D633673, |
Feb 10 2010 |
The Libman Company |
Cloth |
D637193, |
Nov 19 2010 |
Apple Inc |
Electronic device |
D670917, |
Feb 18 2011 |
Columbia Sportswear North America, Inc. |
Heat reflective lining material |
D673922, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
D674759, |
Aug 19 2010 |
EPISTAR CORPORATION |
Wafer carrier |
68316, |
|
|
|
D686175, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D686582, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D690671, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
D702445, |
May 11 2012 |
Columbia Sportswear North America, Inc. |
Printed cooling material |
D704155, |
Feb 18 2011 |
EPISTAR CORPORATION |
Wafer carrier |
D716743, |
Mar 25 2014 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory |
D727861, |
Aug 24 2013 |
GEEHY MICROELECTRONICS INC |
Ink cartridge chip |
D730304, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
D753073, |
Dec 30 2014 |
GN AUDIO A S |
Printed circuit board |
D757666, |
Oct 16 2014 |
Japan Aviation Electronics Industry, Limited |
Flexible printed circuit |
D761745, |
Jun 28 2013 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
D764424, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
D768115, |
Feb 05 2015 |
RF Digital Corporation |
Module |
JP1104233, |
|
|
|
JP1287854, |
|
|
|
JP1426168, |
|
|
|
JP1479369, |
|
|
|
JP1479370, |
|
|
|
KR300470075, |
|
|
|
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