Patent
   D793973
Priority
Jan 14 2015
Filed
Jul 14 2015
Issued
Aug 08 2017
Expiry
Aug 08 2032

TERM.DISCL.
Assg.orig
Entity
unknown
11
34
n/a
The ornamental design for a substrate for an electronic circuit, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a substrate for an electronic circuit, showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side view thereof, the left side being symmetrical;

FIG. 8 is a cross sectional view thereof, taken along line 8-8 in FIG. 3; and,

FIG. 9 is a cross sectional view thereof, taken along line 9-9 in FIG. 3.

The broken line portion of the figure drawings is included to show portions of the article that form no part of the claimed design.

Matsumoto, Manabu, Toyoda, Yasumasa

Patent Priority Assignee Title
D824910, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D826944, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D826945, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D826946, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D828357, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D828358, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D834025, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D848432, Feb 17 2017 Samsung Electronics Co., Ltd. SSD storage device
D869469, Apr 09 2018 Samsung Electronics Co., Ltd. SSD storage device
D869470, Apr 09 2018 Samsung Electronics Co., Ltd. SSD storage device
ER8907,
Patent Priority Assignee Title
5303121, Dec 28 1992 TAIWAN SEMICONDUCTOR MANUFACTURING CO , LTD Multi-chip module board
6307754, Dec 09 1999 Gateway, Inc. Circuit card guide
6347394, Nov 04 1998 Round Rock Research, LLC Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals
6765278, Aug 24 2000 Heetronix Circuit structure with W, WC and/or W2C layer on AlN substrate
20070274032,
20080137278,
20090279243,
20100264520,
20110122481,
20130306991,
20150355686,
20160172016,
20160334992,
20170010639,
D432096, Nov 24 1999 Samsung Electronics Co., Ltd. Semiconductor module
D459706, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D637193, Nov 19 2010 Apple Inc Electronic device
D652041, Nov 19 2010 Apple Inc. Electronic device
D655296, Oct 18 2010 Apple Inc. Electronic device
D673921, Apr 21 2011 Kioxia Corporation Portion of a substrate for an electronic circuit
D673922, Apr 21 2011 Kioxia Corporation Portion of a substrate for an electronic circuit
D686215, Nov 19 2010 Apple Inc. Electronic device
D716310, Jun 09 2012 Apple Inc Electronic device
D730304, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D753073, Dec 30 2014 GN AUDIO A S Printed circuit board
D764424, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778851, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778852, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
JP1104233,
JP1152236,
JP1426166,
JP1436226,
JP1479369,
JP1479370,
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 17 2015MATSUMOTO, MANABUKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0360760526 pdf
Jun 17 2015TOYODA, YASUMASAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0360760526 pdf
Jul 14 2015Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Jan 16 2018Kabushiki Kaisha ToshibaKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0451030298 pdf
Jan 16 2018Kabushiki Kaisha ToshibaTOSHIBA MEMORY CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0451030298 pdf
Oct 01 2019TOSHIBA MEMORY CORPORATIONKioxia CorporationCHANGE OF NAME SEE DOCUMENT FOR DETAILS 0518420627 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule