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The ornamental design for a hybrid integrated circuit device, as shown and described.
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FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Wasada, Yoshiyuki, Ebihara, Hitoshi, Yoda, Hideki, Tomaru, Naoki
| Patent | Priority | Assignee | Title |
| D655697, | Jan 20 2010 | TELIT CINTERION DEUTSCHLAND GMBH | Radio frequency module |
| D660828, | Nov 09 2010 | GEMALTO M2M GMBH | Wireless module |
| D691101, | Nov 08 2011 | Seiko Epson Corporation | Circuit board for an ink cartridge |
| D712854, | Apr 26 2013 | NOK Corporation | Integrated circuit tag |
| D725054, | Jul 31 2013 | Tower Manufacturing Company | Ground fault circuit interrupter (GFCI) printed circuit board package |
| D730304, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
| D730849, | Oct 05 2012 | Tower Manufacturing Company | Universal ground fault circuit interrupter (GFCI) printed circuit board package |
| D731990, | Apr 18 2012 | NOK Corporation | Integrated circuit tag |
| D738833, | Mar 07 2013 | QA Trading LLC | Circuit board cufflink |
| D740239, | May 07 2014 | LED illumination tile | |
| D745476, | Oct 19 2012 | Solumatics CVBA | Print board |
| D753073, | Dec 30 2014 | GN AUDIO A S | Printed circuit board |
| D764424, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
| D770991, | Nov 05 2013 | NOK Corporation | Integrated circuit tag |
| D778850, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
| D778851, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
| D778852, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
| D787456, | Jan 14 2015 | Kioxia Corporation | Substrate for an electronic circuit |
| D787457, | Jan 14 2015 | Kioxia Corporation | Substrate for an electronic circuit |
| D793973, | Jan 14 2015 | Kioxia Corporation | Substrate for an electronic circuit |
| D794034, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D794641, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D794642, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D794643, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D794644, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D795261, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D795262, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
| D798251, | Nov 07 2016 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
| D804437, | Sep 30 2016 | NORTON WATERFORD LIMITED | Circuit board |
| D821987, | Apr 27 2016 | NGK Insulators, Ltd. | Flexible printed circuits |
| D843334, | May 11 2016 | NGK Insulators, Ltd. | Flexible printed circuits |
| D852763, | Aug 31 2017 | ebm-papst Landshut GmbH | Circuit board |
| D855577, | Apr 12 2018 | Telebox Industries Corp. | Circuit board for electrical connector |
| D883962, | Apr 25 2017 | THE ANTENNA COMPANY INTERNATIONAL N V | Dual port antenna assembly |
| D909319, | Jul 08 2020 | Impact IP, LLC | Circuit board |
| D915310, | Feb 12 2019 | Analog Devices, Inc. | Circuit board |
| D930601, | Sep 09 2019 | The Noco Company | Circuit board |
| D937230, | Dec 20 2019 | FLEECE PERFORMANCE ENGINEERING, INC. | Circuit board |
| D937792, | Sep 09 2019 | The Noco Company | Circuit board |
| D937793, | Sep 09 2019 | The Noco Company | Circuit board |
| D938374, | Sep 09 2019 | The Noco Company | Circuit board |
| D944219, | Sep 09 2019 | The Noco Company | Circuit board |
| D949117, | Sep 09 2019 | The Noco Company | Circuit board |
| D956707, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Circuit board |
| D958762, | Sep 09 2019 | The Noco Company | Circuit board |
| D989014, | Sep 09 2019 | The Noco Company | Circuit board |
| ER1044, | |||
| ER1679, | |||
| ER1698, | |||
| ER1824, | |||
| ER1952, | |||
| ER2307, | |||
| ER3431, | |||
| ER4226, | |||
| ER428, | |||
| ER4605, | |||
| ER522, | |||
| ER5245, | |||
| ER5681, | |||
| ER6091, | |||
| ER686, | |||
| ER7588, | |||
| ER792, | |||
| ER80, | |||
| ER818, | |||
| ER8298, | |||
| ER8374, | |||
| ER9399, | |||
| ER9526, |
| Patent | Priority | Assignee | Title |
| 5742480, | Nov 02 1994 | SUMITOMO ELECTRIC INDUSTRIES, LTD | Optical module circuit board having flexible structure |
| 5838546, | Apr 12 1996 | NEC Corporation | Mounting structure for a semiconductor circuit |
| 5905639, | Sep 29 1997 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
| 6028773, | Nov 14 1997 | Apple Inc | Packaging for silicon sensors |
| 6201701, | Mar 11 1998 | STELLAR MICROELECTRONICS, INC | Integrated substrate with enhanced thermal characteristics |
| D357671, | Sep 16 1993 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| D396450, | Dec 24 1996 | FUJI ELECTRIC CO , LTD | Hybrid integrated circuit for electric power control |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 24 2001 | EBIHARA, HITOSHI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | TOMARU, NAOKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | WASADA, YOSHIYUKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | ITO, TETSUYA | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | KATO, HIDEKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | IGARASHI, TOMOHIRO | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 24 2001 | YODA, HIDEKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0327 | |
| Jul 26 2001 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / |
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