Patent
   D459706
Priority
Apr 27 2001
Filed
Jul 26 2001
Issued
Jul 02 2002
Expiry
Jul 02 2016
Assg.orig
Entity
unknown
57
7
n/a
The ornamental design for a hybrid integrated circuit device, as shown and described.

FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Wasada, Yoshiyuki, Ebihara, Hitoshi, Yoda, Hideki, Tomaru, Naoki

Patent Priority Assignee Title
D655697, Jan 20 2010 TELIT CINTERION DEUTSCHLAND GMBH Radio frequency module
D660828, Nov 09 2010 GEMALTO M2M GMBH Wireless module
D691101, Nov 08 2011 Seiko Epson Corporation Circuit board for an ink cartridge
D712854, Apr 26 2013 NOK Corporation Integrated circuit tag
D725054, Jul 31 2013 Tower Manufacturing Company Ground fault circuit interrupter (GFCI) printed circuit board package
D730304, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D730849, Oct 05 2012 Tower Manufacturing Company Universal ground fault circuit interrupter (GFCI) printed circuit board package
D731990, Apr 18 2012 NOK Corporation Integrated circuit tag
D738833, Mar 07 2013 QA Trading LLC Circuit board cufflink
D740239, May 07 2014 LED illumination tile
D745476, Oct 19 2012 Solumatics CVBA Print board
D753073, Dec 30 2014 GN AUDIO A S Printed circuit board
D764424, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D770991, Nov 05 2013 NOK Corporation Integrated circuit tag
D778850, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778851, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778852, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D787456, Jan 14 2015 Kioxia Corporation Substrate for an electronic circuit
D787457, Jan 14 2015 Kioxia Corporation Substrate for an electronic circuit
D793973, Jan 14 2015 Kioxia Corporation Substrate for an electronic circuit
D794034, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794641, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794642, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794643, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794644, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D795261, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D795262, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D798251, Nov 07 2016 Transcend Information, Inc. Printed circuit board of solid-state memory
D804437, Sep 30 2016 NORTON WATERFORD LIMITED Circuit board
D821987, Apr 27 2016 NGK Insulators, Ltd. Flexible printed circuits
D843334, May 11 2016 NGK Insulators, Ltd. Flexible printed circuits
D852763, Aug 31 2017 ebm-papst Landshut GmbH Circuit board
D855577, Apr 12 2018 Telebox Industries Corp. Circuit board for electrical connector
D883962, Apr 25 2017 THE ANTENNA COMPANY INTERNATIONAL N V Dual port antenna assembly
D909319, Jul 08 2020 Impact IP, LLC Circuit board
D915310, Feb 12 2019 Analog Devices, Inc. Circuit board
D930601, Sep 09 2019 The Noco Company Circuit board
D937230, Dec 20 2019 FLEECE PERFORMANCE ENGINEERING, INC. Circuit board
D937792, Sep 09 2019 The Noco Company Circuit board
D937793, Sep 09 2019 The Noco Company Circuit board
D938374, Sep 09 2019 The Noco Company Circuit board
D944219, Sep 09 2019 The Noco Company Circuit board
D949117, Sep 09 2019 The Noco Company Circuit board
D956707, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Circuit board
D958762, Sep 09 2019 The Noco Company Circuit board
D989014, Sep 09 2019 The Noco Company Circuit board
ER1044,
ER1698,
ER1824,
ER1952,
ER4226,
ER428,
ER522,
ER5681,
ER686,
ER792,
ER9526,
Patent Priority Assignee Title
5742480, Nov 02 1994 SUMITOMO ELECTRIC INDUSTRIES, LTD Optical module circuit board having flexible structure
5838546, Apr 12 1996 NEC Corporation Mounting structure for a semiconductor circuit
5905639, Sep 29 1997 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
6028773, Nov 14 1997 Apple Inc Packaging for silicon sensors
6201701, Mar 11 1998 STELLAR MICROELECTRONICS, INC Integrated substrate with enhanced thermal characteristics
D357671, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 2001EBIHARA, HITOSHITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001TOMARU, NAOKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001WASADA, YOSHIYUKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001ITO, TETSUYATAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001KATO, HIDEKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001IGARASHI, TOMOHIROTAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 24 2001YODA, HIDEKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230327 pdf
Jul 26 2001Taiyo Yuden Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule