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Patent
D778850
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Priority
May 15 2014
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Filed
May 13 2016
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Issued
Feb 14 2017
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Expiry
Feb 14 2032
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Assg.orig
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Entity
unknown
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16
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43
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n/a
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The ornamental design for a substrate for an electronic circuit, as shown and described.
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FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design.
Matsumoto, Manabu, Ozawa, Isao
Patent |
Priority |
Assignee |
Title |
10070176, |
Mar 13 2013 |
NAGRASTAR, LLC |
Systems and methods for performing transport I/O |
10382816, |
Mar 13 2013 |
NAGRASTAR, LLC |
Systems and methods for performing transport I/O |
D798251, |
Nov 07 2016 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory |
D806046, |
Apr 16 2015 |
Veeco Instruments Inc. |
Wafer carrier with a multi-pocket configuration |
D821987, |
Apr 27 2016 |
NGK Insulators, Ltd. |
Flexible printed circuits |
D831009, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
D840404, |
Mar 13 2013 |
NAGRASTAR, LLC |
Smart card interface |
D843334, |
May 11 2016 |
NGK Insulators, Ltd. |
Flexible printed circuits |
D852762, |
Mar 27 2015 |
Veeco Instruments Inc. |
Wafer carrier with a 14-pocket configuration |
D864968, |
Apr 30 2015 |
NAGRASTAR, LLC |
Smart card interface |
D904355, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
D934820, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D937232, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D937233, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D938925, |
Oct 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D942974, |
Nov 20 2018 |
THALES DIS AIS DEUTSCHLAND GMBH |
Cellular module |
Patent |
Priority |
Assignee |
Title |
5858481, |
Jan 30 1996 |
Matsushita Electric Industrial Co., Ltd. |
Electronic circuit substrate |
6410355, |
Jun 11 1998 |
SanDisk Technologies LLC |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
7306161, |
Jul 17 2003 |
SanDisk Technologies LLC |
Memory card with chamfer |
7307848, |
Jul 17 2003 |
SanDisk Technologies LLC |
Memory card with raised portion |
7864540, |
Jul 17 2003 |
SanDisk Technologies LLC |
Peripheral card with sloped edges |
20030094628, |
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20060168721, |
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20080123318, |
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Taiyo Yuden Co., Ltd. |
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Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
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Toshiba Lighting & Technology Corporation |
Light emitting diode module |
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Toshiba Lighting & Technology Corporation |
Light emitting diode module |
D608741, |
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Panasonic Corporation |
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D633672, |
Feb 10 2010 |
The Libman Company |
Pad |
D633673, |
Feb 10 2010 |
The Libman Company |
Cloth |
D637193, |
Nov 19 2010 |
Apple Inc |
Electronic device |
D670917, |
Feb 18 2011 |
Columbia Sportswear North America, Inc. |
Heat reflective lining material |
D673922, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
D674759, |
Aug 19 2010 |
EPISTAR CORPORATION |
Wafer carrier |
68316, |
|
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|
D686175, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D686582, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D690671, |
Mar 20 2012 |
Veeco Instruments INC |
Wafer carrier having pockets |
D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
D702445, |
May 11 2012 |
Columbia Sportswear North America, Inc. |
Printed cooling material |
D704155, |
Feb 18 2011 |
EPISTAR CORPORATION |
Wafer carrier |
D716743, |
Mar 25 2014 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory |
D727861, |
Aug 24 2013 |
GEEHY MICROELECTRONICS INC |
Ink cartridge chip |
D730304, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
D753073, |
Dec 30 2014 |
GN AUDIO A S |
Printed circuit board |
D757666, |
Oct 16 2014 |
Japan Aviation Electronics Industry, Limited |
Flexible printed circuit |
D761745, |
Jun 28 2013 |
Sumitomo Electric Industries, Ltd. |
Semiconductor device |
D764424, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
D768115, |
Feb 05 2015 |
RF Digital Corporation |
Module |
JP104233, |
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|
JP1287854, |
|
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JP1426168, |
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JP1479369, |
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JP1479370, |
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KR300470075, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a