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The ornamental design for a hybrid integrated circuit device, as shown and described.
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FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Wasada, Yoshiyuki, Ebihara, Hitoshi, Yoda, Hideki, Tomaru, Naoki
Patent | Priority | Assignee | Title |
D521953, | Mar 08 2004 | Mitsumi Electric Co., Ltd. | Transmitting unit |
D524763, | Mar 08 2004 | Mitsumi Electric Co., Ltd. | Transmitting/receiving unit |
D570307, | Nov 30 2006 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
D576577, | Nov 30 2006 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
D597504, | Nov 30 2006 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
D655697, | Jan 20 2010 | TELIT CINTERION DEUTSCHLAND GMBH | Radio frequency module |
D660828, | Nov 09 2010 | GEMALTO M2M GMBH | Wireless module |
D690672, | Oct 04 2011 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
D691101, | Nov 08 2011 | Seiko Epson Corporation | Circuit board for an ink cartridge |
D693318, | Oct 27 2011 | SUMITOMO ELECTRIC INDUSTRIES, LTD | Semiconductor module for power conversion |
D699201, | Oct 01 2012 | TELIT CINTERION DEUTSCHLAND GMBH | Pad arrangement of a circuit module |
D712854, | Apr 26 2013 | NOK Corporation | Integrated circuit tag |
D720354, | Nov 22 2011 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC card |
D730304, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
D731990, | Apr 18 2012 | NOK Corporation | Integrated circuit tag |
D740239, | May 07 2014 | LED illumination tile | |
D745476, | Oct 19 2012 | Solumatics CVBA | Print board |
D753073, | Dec 30 2014 | GN AUDIO A S | Printed circuit board |
D757666, | Oct 16 2014 | Japan Aviation Electronics Industry, Limited | Flexible printed circuit |
D764424, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
D770991, | Nov 05 2013 | NOK Corporation | Integrated circuit tag |
D774478, | Feb 04 2015 | L&L Candle Company, LLC; LIOWN HOLDINGS, INC | Flame-shaped printed circuit board for electronic candle or other electronic light |
D778850, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
D778851, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
D778852, | May 15 2014 | Kioxia Corporation | Substrate for an electronic circuit |
D794034, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794641, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794642, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794643, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794644, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D795261, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D795262, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D804437, | Sep 30 2016 | NORTON WATERFORD LIMITED | Circuit board |
D852763, | Aug 31 2017 | ebm-papst Landshut GmbH | Circuit board |
D855577, | Apr 12 2018 | Telebox Industries Corp. | Circuit board for electrical connector |
D877133, | Mar 26 2018 | SPIGEN KOREA CO , LTD | Case for electronic devices |
D896213, | Mar 26 2018 | Spigen Korea CO., LTD. | Case for electronic devices |
D909319, | Jul 08 2020 | Impact IP, LLC | Circuit board |
D915310, | Feb 12 2019 | Analog Devices, Inc. | Circuit board |
D919583, | Aug 26 2020 | Mortarboard with electronic tube display | |
D930601, | Sep 09 2019 | The Noco Company | Circuit board |
D937230, | Dec 20 2019 | FLEECE PERFORMANCE ENGINEERING, INC. | Circuit board |
D937792, | Sep 09 2019 | The Noco Company | Circuit board |
D937793, | Sep 09 2019 | The Noco Company | Circuit board |
D938374, | Sep 09 2019 | The Noco Company | Circuit board |
D944219, | Sep 09 2019 | The Noco Company | Circuit board |
D949117, | Sep 09 2019 | The Noco Company | Circuit board |
D956707, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Circuit board |
D958762, | Sep 09 2019 | The Noco Company | Circuit board |
D989014, | Sep 09 2019 | The Noco Company | Circuit board |
ER1044, | |||
ER1698, | |||
ER1824, | |||
ER1952, | |||
ER4226, | |||
ER428, | |||
ER522, | |||
ER5479, | |||
ER5681, | |||
ER686, | |||
ER792, | |||
ER9526, |
Patent | Priority | Assignee | Title |
5742480, | Nov 02 1994 | SUMITOMO ELECTRIC INDUSTRIES, LTD | Optical module circuit board having flexible structure |
5838546, | Apr 12 1996 | NEC Corporation | Mounting structure for a semiconductor circuit |
5905639, | Sep 29 1997 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
6028773, | Nov 14 1997 | Apple Inc | Packaging for silicon sensors |
6201701, | Mar 11 1998 | STELLAR MICROELECTRONICS, INC | Integrated substrate with enhanced thermal characteristics |
D357671, | Sep 16 1993 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
D396450, | Dec 24 1996 | FUJI ELECTRIC CO , LTD | Hybrid integrated circuit for electric power control |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 05 2002 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / |
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