FIG. 1 is a front view of a first embodiment of a semiconductor module for power conversion showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, right, top perspective view thereof;
FIG. 8 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 8-8 of FIG. 1;
FIG. 9 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 1 shown in a used condition;
FIG. 10 a front view of a second embodiment of a semiconductor module for power conversion showing my new design;
FIG. 11 is a rear view thereof;
FIG. 12 is a top view thereof;
FIG. 13 is a bottom view thereof;
FIG. 14 is a right side view thereof;
FIG. 15 is a left side view thereof;
FIG. 16 is a front, right, top perspective view thereof;
FIG. 17 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 17-17 of FIG. 10; and,
FIG. 18 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 10 shown in a used condition.
The broken lines shown in the drawings represent portions of the semiconductor module for power conversion that form no part of the claimed design.
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