Patent
   D693318
Priority
Oct 27 2011
Filed
Mar 29 2012
Issued
Nov 12 2013
Expiry
Nov 12 2027
Assg.orig
Entity
unknown
3
25
n/a
The ornamental design for a semiconductor module for power conversion, as shown and described.

FIG. 1 is a front view of a first embodiment of a semiconductor module for power conversion showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front, right, top perspective view thereof;

FIG. 8 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 8-8 of FIG. 1;

FIG. 9 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 1 shown in a used condition;

FIG. 10 a front view of a second embodiment of a semiconductor module for power conversion showing my new design;

FIG. 11 is a rear view thereof;

FIG. 12 is a top view thereof;

FIG. 13 is a bottom view thereof;

FIG. 14 is a right side view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a front, right, top perspective view thereof;

FIG. 17 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 17-17 of FIG. 10; and,

FIG. 18 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 10 shown in a used condition.

The broken lines shown in the drawings represent portions of the semiconductor module for power conversion that form no part of the claimed design.

Shinkai, Jiro

Patent Priority Assignee Title
D724554, Feb 19 2014 Fuji Electric Co., Ltd. Semiconductor module
D755186, Feb 20 2015 Katun Corporation Toner container memory chip
D755793, Feb 20 2015 Katun Corporation Toner container memory chip
Patent Priority Assignee Title
5956231, Oct 07 1994 HITACHI POWER SEMICONDUCTOR DEVICE, LTD Semiconductor device having power semiconductor elements
6078501, Dec 22 1997 Omnirel LLC Power semiconductor module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
7425757, Dec 22 2003 FUJI ELECTRIC CO , LTD Semiconductor power module
20010038143,
20070294889,
20100149774,
20110044012,
D357671, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D357672, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D357901, Sep 27 1993 Telefonaktiebolaget L M Ericsson Power supply unit
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D471524, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D576577, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D597504, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D615506, Jun 23 2009 DBG Group Investments, LLC Integrated energy management system
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
TW477628,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 29 2012Sumitomo Electric Industries, Ltd.(assignment on the face of the patent)
Apr 27 2012SHINKAI, JIROSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0283300688 pdf
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