Patent
   D589012
Priority
Mar 17 2008
Filed
Jun 18 2008
Issued
Mar 24 2009
Expiry
Mar 24 2023
Assg.orig
Entity
unknown
68
15
n/a
The ornamental design for semiconductor device, as shown and described.

FIG. 1 is a perspective view of the front, right and bottom of semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Soyano, Shin, Nishiura, Akira

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 06 2008SOYANO, SHINFUJI ELECTRIC DEVICE TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0212840126 pdf
Jun 06 2008NISHIURA, AKIRAFUJI ELECTRIC DEVICE TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0212840126 pdf
Jun 18 2008Fuji Electric Device Technology Co., Ltd.(assignment on the face of the patent)
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