Patent
   D706232
Priority
Dec 21 2012
Filed
Jun 21 2013
Issued
Jun 03 2014
Expiry
Jun 03 2028
Assg.orig
Entity
unknown
26
21
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front view of a semiconductor device showing my new design;

FIG. 2 is a rear view of the semiconductor device of FIG. 1;

FIG. 3 is a left side view of the semiconductor device of FIG. 1;

FIG. 4 is a right side view of the semiconductor device of FIG. 1;

FIG. 5 is a top view of the semiconductor device of FIG. 1;

FIG. 6 is a bottom view of the semiconductor device of FIG. 1; and,

FIG. 7 is a perspective view of the semiconductor device of FIG. 1.

The ornamental design of the present disclosure is a semiconductor device forming a case that may accommodate a plurality of semiconductor modules arranged in a line.

Nakamura, Hideyo

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D772184, Dec 24 2014 Fuji Electric Co., Ltd. Semiconductor module
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D785577, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
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D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
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D825501, Oct 14 2016 KOKUSAI ELECTRIC CORPORATION Air flow controller for heater of substrate processing apparatus
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D949808, Nov 27 2020 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
Patent Priority Assignee Title
5057648, Nov 20 1989 Micron Technology, Inc High voltage hybrid package
5408128, Sep 15 1993 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
5761040, Dec 20 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
6078501, Dec 22 1997 Omnirel LLC Power semiconductor module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
7425757, Dec 22 2003 FUJI ELECTRIC CO , LTD Semiconductor power module
20010038143,
20110044012,
D357672, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D364383, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364384, May 23 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364385, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 21 2013Fuji Electric Co., Ltd.(assignment on the face of the patent)
Jun 21 2013NAKAMURA, HIDEYOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0307090665 pdf
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