Patent
   D364384
Priority
May 23 1994
Filed
Sep 16 1994
Issued
Nov 21 1995
Expiry
Nov 21 2009
Assg.orig
Entity
unknown
46
3
n/a
The ornamental design for a semi-conductor element with terminal casing, as shown.

FIG. 1 is a perspective view of the front, top and right side of a semi-conductor element with terminal casing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Kobayashi, Shinichi, Yamada, Katsumi, Shimizu, Tomio, Nakahira, Akira

Patent Priority Assignee Title
D464618, Apr 23 2001 Kabushiki Kaisha Toshiba Power converter
D467869, Jun 19 2001 Kabushiki Kaisha Toshiba Portion of power converter
D475012, Jun 19 2001 Kabushiki Kaisha Toshiba Portion of a power converter
D476622, Jun 19 2001 Kabushiki Kaisha Toshiba Portion of a power converter
D525584, Dec 11 2002 MOLON MOTOR & COIL CORPORATION Three-lead reversing motor
D593951, Feb 05 2008 Terminal
D594419, Feb 05 2008 Terminal
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D712853, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D714745, Feb 14 2012 Panasonic Corporation Semiconductor
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D721340, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D727266, May 31 2012 Sick AG Connecting module
D727267, Mar 28 2013 Sick AG Connecting module
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D754084, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D755741, Feb 18 2015 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Power device package
D755742, Feb 18 2015 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Power device package
D759604, Jun 17 2015 Mitsubishi Electric Corporation Semiconductor device
D761746, Nov 04 2014 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D768087, Nov 19 2014 GRIDLESS POWER CORPORATION Power connection panel
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D785577, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D790491, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D798832, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D820218, Dec 20 2016 Molex, LLC Connector housing
D827591, Oct 31 2016 Fuji Electric Co., Ltd. Semiconductor module
D847103, Sep 07 2017 ROHM CO , LTD Power semiconductor module
D847104, Sep 29 2017 ROHM CO , LTD Power semiconductor module
D858467, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D864132, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D873227, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D875058, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D910575, Jan 07 2019 Rockwell Automation Technologies, Inc. Electrical disconnect switch
D916039, Mar 20 2020 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
D981969, Dec 18 2020 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
Patent Priority Assignee Title
4252864, Oct 10 1978 AMP Incorporated Lead frame having integral terminal tabs
4510677, Apr 08 1981 Thomson CSF Cases with flat terminal lugs for medium power semi-conductor components and a process for manufacturing same
5408128, Sep 15 1993 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 25 1994SHIMIZU, TOMIOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0071610026 pdf
Aug 25 1994NAKAHIRA, AKIRAFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0071610026 pdf
Aug 25 1994KOBAYASHI, SHINICHIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0071610026 pdf
Aug 25 1994YAMADA, KATSUMIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0071610026 pdf
Sep 16 1994Fuji Electric Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule