Patent
   D873227
Priority
Oct 23 2017
Filed
Jun 12 2019
Issued
Jan 21 2020
Expiry
Jan 21 2035
Assg.orig
Entity
unknown
10
50
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Yamashita, Akihiko, Ando, Masayuki, Yoneyama, Rei, Tsukamoto, Hideki, Aoki, Nobuchika

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Patent Priority Assignee Title
5512782, Oct 13 1993 FUJI ELECTRIC CO , LTD Semiconductor device for DC/AC converter
6078501, Dec 22 1997 Omnirel LLC Power semiconductor module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
7425757, Dec 22 2003 FUJI ELECTRIC CO , LTD Semiconductor power module
8107255, Sep 27 2007 Semiconductor Components Industries, LLC Circuit device and method of manufacturing the same
8526199, May 07 2010 Mitsubishi Electric Corporation Semiconductor device
9418975, Mar 24 2015 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
9660356, Nov 25 2015 Fuji Electric Co., Ltd. Semiconductor device
20010038143,
20040227231,
20080142948,
20100149774,
D288557, Sep 10 1984 Semiconductor Components Industries, LLC Semiconductor housing
D357672, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D360619, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D364383, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364384, May 23 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D556686, Apr 27 2006 Hitachi, LTD Power module for power inverter
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D712853, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D754084, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D759604, Jun 17 2015 Mitsubishi Electric Corporation Semiconductor device
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D767516, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D774479, Nov 28 2014 Fuji Electric Co., Ltd. Semiconductor module
D783549, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D790491, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D814431, May 15 2015 Mitsubishi Electric Corporation Power semiconductor device
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D847103, Sep 07 2017 ROHM CO , LTD Power semiconductor module
D858467, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2018YONEYAMA, REIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0494490796 pdf
Mar 26 2018AOKI, NOBUCHIKAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0494490796 pdf
Mar 26 2018YAMASHITA, AKIHIKOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0494490796 pdf
Mar 27 2018TSUKAMOTO, HIDEKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0494490796 pdf
Mar 27 2018ANDO, MASAYUKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0494490796 pdf
Jun 12 2019Mitsubishi Electric Corporation(assignment on the face of the patent)
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