Patent
   D859334
Priority
Oct 26 2017
Filed
Apr 05 2018
Issued
Sep 10 2019
Expiry
Sep 10 2034
Assg.orig
Entity
unknown
19
43
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a right side view thereof.

Mori, Shigeru, Yokoyama, Shuhei, Hasegawa, Maki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2018YOKOYAMA, SHUHEIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454500088 pdf
Mar 29 2018HASEGAWA, MAKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454500088 pdf
Mar 29 2018MORI, SHIGERUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454500088 pdf
Apr 05 2018Mitsubishi Electric Corporation(assignment on the face of the patent)
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