Patent
   D259782
Priority
Jul 28 1978
Filed
Jan 24 1979
Issued
Jul 07 1981
Expiry
Jul 07 1995
Assg.orig
Entity
unknown
15
3
n/a
The ornamental design for a semiconductor, as shown.

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a bottom view thereof.

Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo

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Patent Priority Assignee Title
3208892,
3436451,
4012766, Aug 28 1973 Western Digital Corporation Semiconductor package and method of manufacture thereof
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 08 1979OTSUKI, KEIZOHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250591 pdf
Jan 08 1979KOSAKA, HIDEKIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250591 pdf
Jan 08 1979MORAKAMI, GENHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250591 pdf
Jan 08 1979MOCHIZUKI HIDETOSHIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250591 pdf
Jan 24 1979Hitachi, Ltd.(assignment on the face of the patent)
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