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Patent
D832228
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Priority
Nov 15 2016
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Filed
May 04 2017
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Issued
Oct 30 2018
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Expiry
Oct 30 2033
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Assg.orig
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Entity
unknown
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15
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38
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.
Yoshimochi, Kenichi, Saito, Koshun, Chikamatsu, Kentaro
Patent |
Priority |
Assignee |
Title |
D845921, |
May 02 2017 |
Rohm Co., Ltd. |
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D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
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Oct 19 2017 |
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D929946, |
Jan 04 2019 |
LiBEST INC.; LIBEST INC |
Electrode assembly |
D937231, |
Apr 06 2020 |
WOLFSPEED, INC |
Power semiconductor package |
D945384, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Semiconductor module |
D969762, |
Apr 06 2020 |
WOLFSPEED, INC. |
Power semiconductor package |
ER1993, |
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ER3567, |
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ER3700, |
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ER4359, |
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ER5833, |
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ER6472, |
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ER708, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a