Patent
   D832228
Priority
Nov 15 2016
Filed
May 04 2017
Issued
Oct 30 2018
Expiry
Oct 30 2033
Assg.orig
Entity
unknown
10
38
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.

Yoshimochi, Kenichi, Saito, Koshun, Chikamatsu, Kentaro

Patent Priority Assignee Title
D845921, May 02 2017 Rohm Co., Ltd. Semiconductor device
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D904325, Mar 20 2019 Sansha Electric Manufacturing Company, Limited Semiconductor module
D929946, Jan 04 2019 LiBEST INC.; LIBEST INC Electrode assembly
D937231, Apr 06 2020 WOLFSPEED, INC Power semiconductor package
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
ER6472,
ER708,
Patent Priority Assignee Title
4663833, May 14 1984 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
5105257, Aug 08 1990 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
5347160, Sep 28 1992 Sundstrand Corporation Power semiconductor integrated circuit package
5798570, Jun 28 1996 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
6093957, Apr 18 1997 LG Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
6238953, Jan 12 1999 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
6330165, Jul 06 1998 MURATA MANUFACTURING CO , LTD Semiconductor device
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
6555899, Oct 15 1999 AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD Semiconductor package leadframe assembly and method of manufacture
6992386, Jul 31 2003 Renesas Electronics Corporation Semiconductor device and a method of manufacturing the same
20010038143,
D259559, Jul 28 1978 Hitachi, LTD Semiconductor
D259560, Jul 28 1978 Hitachi, Ltd. Semiconductor
D259782, Jul 28 1978 Hitachi, Ltd. Semiconductor
D259783, Aug 25 1978 Hitachi, Ltd. Semiconductor
D260091, Aug 25 1978 Hitachi, Ltd. Semiconductor
D260986, Aug 25 1978 Hitachi, Ltd. Semiconductor
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D397092, Jan 03 1997 Fujitsu Limited Integrated circuit package
D416236, Sep 02 1998 SII CRYSTAL TECHNOLOGY INC Integrated circuit package
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D466485, May 23 2001 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
D466873, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D472528, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D475028, Mar 11 2002 Kabushiki Kaisha Toshiba Semiconductor device
D475355, Mar 11 2002 Kabushiki Kaisha Toshiba Semiconductor device
D475982, Mar 11 2002 Kabushiki Kaisha Toshiba Semiconductor device
D476962, Mar 29 2002 Kabushiki Kaisha Toshiba Semiconductor device
D480371, Nov 30 2001 Kabushiki Kaisha Toshiba Semiconductor device
D489338, Jul 28 2003 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Packaged semiconductor device
D504874, Aug 11 2004 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Semiconductor device package
D509810, Jul 30 2003 Delta Electronics Inc. Molding structure of electric element
D510728, Aug 11 2004 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Semiconductor device package
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D648290, Jun 08 2010 Miyoshi Electronics Corporation Semiconductor device
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D796459, Apr 11 2016 Rohm Co., Ltd. Packaged semiconductor circuit module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 10 2017CHIKAMATSU, KENTAROROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0422500280 pdf
Apr 10 2017SAITO, KOSHUNROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0422500280 pdf
Apr 10 2017YOSHIMOCHI, KENICHIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0422500280 pdf
May 04 2017Rohm Co., Ltd.(assignment on the face of the patent)
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