Patent
   D489338
Priority
Jul 28 2003
Filed
Jul 28 2003
Issued
May 04 2004
Expiry
May 04 2018
Assg.orig
Entity
unknown
34
9
n/a
We claim the ornamental design for a packaged semiconductor device, as shown and described.

FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;

FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;

FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;

FIG. 4 is a top view of the packaged semiconductor device;

FIG. 5 is a bottom view of the packaged semiconductor device;

FIG. 6 is an elevational view from the left side of the packaged semiconductor device;

FIG. 7 is an elevational view from the right side of the packaged semiconductor device;

FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,

FIG. 9 is an elevational view from the front side of the packaged semiconductor device.

Kime, Kent L., Seddon, Michael, Carney, Francis

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 28 2003Semiconductor Components Industries, L.L.C.(assignment on the face of the patent)
Jul 28 2003SEDDON, MICHAELSemiconductor Components IndustriesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143410276 pdf
Jul 28 2003CARNEY, FRANCISSemiconductor Components IndustriesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143410276 pdf
Jul 28 2003KIME, KENT L Semiconductor Components IndustriesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143410276 pdf
Sep 23 2003Semiconductor Components Industries, LLCJPMorgan Chase Bank, as Collateral AgentSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0148300212 pdf
Sep 06 2007Semiconductor Components Industries, LLCJPMORGAN CHASE BANK, N A SECURITY AGREEMENT0197950808 pdf
May 11 2010JPMORGAN CHASE BANK, N A Semiconductor Components Industries, LLCRELEASE OF SECURITY INTEREST0336860092 pdf
Apr 15 2016Semiconductor Components Industries, LLCDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTCORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST 0398530001 pdf
Apr 15 2016Semiconductor Components Industries, LLCDEUTSCHE BANK AG NEW YORK BRANCHSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0386200087 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTSemiconductor Components Industries, LLCRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 00870640700001 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTFairchild Semiconductor CorporationRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 00870640700001 pdf
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