Patent
   D920266
Priority
Sep 29 2019
Filed
Mar 17 2020
Issued
May 25 2021
Expiry
May 25 2036
Assg.orig
Entity
unknown
0
25
n/a
The ornamental design for an integrated circuit package, as shown.

FIG. 1 is a front elevational view of an integrated circuit package showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a front perspective view thereof; and,

FIG. 8 is a rear perspective view thereof.

Yang, Jian Wei

Patent Priority Assignee Title
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Mar 17 2020YANG, JIAN WEICHINA CHIPPACKING TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0521430868 pdf
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