Patent
   D902164
Priority
Jan 24 2019
Filed
Jun 27 2019
Issued
Nov 17 2020
Expiry
Nov 17 2035
Assg.orig
Entity
unknown
41
48
n/a
The ornamental design for an integrated circuit card, as shown and described.

FIG. 1 is a perspective view 1 of an integrated circuit card showing our new design according to a first embodiment thereof,

FIG. 2 is a perspective view 2 thereof,

FIG. 3 is a front elevational view thereof,

FIG. 4 is a top plan view thereof,

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a left side elevational view thereof,

FIG. 7 is a bottom plan view thereof, and

FIG. 8 is a rear elevational view theref.

FIG. 9 is a perspective view 1 of an integrated circuit card showing our new design according to a second embodiment thereof,

FIG. 10 is a perspective view 2 thereof,

FIG. 11 is a front elevational view thereof,

FIG. 12 is a top plan view thereof,

FIG. 13 is a right side elevational view thereof,

FIG. 14 is a left side elevational view thereof,

FIG. 15 is a bottom plan view thereof; and,

FIG. 16 is a rear elevational view thereof.

Kondo, Atsushi, Nishiyama, Taku, Watanabe, Katsuyoshi

Patent Priority Assignee Title
11333677, Jul 23 2018 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
11662698, Jul 23 2018 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
11747775, Jul 23 2018 CACI, Inc.—Federal Integrated tamper detection system and methods
D920265, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D920266, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D928162, Jan 19 2016 Sony Corporation Memory card
D930601, Sep 09 2019 The Noco Company Circuit board
D934820, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D934868, Feb 28 2018 Sony Corporation Memory card
D937232, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937233, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937792, Sep 09 2019 The Noco Company Circuit board
D937793, Sep 09 2019 The Noco Company Circuit board
D938374, Sep 09 2019 The Noco Company Circuit board
D938925, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D944219, Sep 09 2019 The Noco Company Circuit board
D947800, Jul 16 2019 CACI, Inc.—Federal Integrated module
D949117, Sep 09 2019 The Noco Company Circuit board
D954006, Nov 03 2020 Microcircuit for smart card
D956707, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Circuit board
D958762, Sep 09 2019 The Noco Company Circuit board
D980810, Feb 27 2020 Kioxia Corporation Integrated circuit card
D989014, Sep 09 2019 The Noco Company Circuit board
ER1044,
ER1698,
ER1824,
ER1952,
ER2307,
ER3431,
ER4226,
ER428,
ER522,
ER5245,
ER5681,
ER6091,
ER686,
ER7588,
ER792,
ER80,
ER8298,
ER9526,
Patent Priority Assignee Title
10510626, Jul 06 2015 Infineon Technologies AG Method for use in manufacturing a semiconductor device die
10546825, May 24 2017 Advanced Semiconductor Engineering, Inc. Semiconductor package device
10553559, Oct 28 2015 Mitsubishi Electric Corporation Power semiconductor device
10557191, Jan 31 2017 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
10600744, Nov 15 2016 Rohm Co., Ltd. Semiconductor device
10600789, Dec 19 2016 Samsung Electronics Co., Ltd. Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
10605828, Mar 30 2017 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
10636703, May 10 2010 SK KEYFOUNDRY INC Semiconductor device for preventing crack in pad region and fabricating method thereof
10644115, Feb 28 2018 FLOSFIA INC Layered structure and semiconductor device including layered structure
10651050, Dec 01 2017 Micron Technology, Inc. Semiconductor device packages and structures
10672878, Feb 08 2018 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. Silicon carbide semiconductor device
CN302254658,
CN302254659,
CN302268439,
CN302873810,
CN304737519,
D523403, Sep 09 2004 Kioxia Corporation Substrate for a semiconductor device
D552098, May 24 2005 Renesas Electronics Corporation Memory card
D588597, Dec 17 2007 Panasonic Corporation IC memory card
D588598, Apr 01 2008 Panasonic Corporation IC memory card
D588599, Apr 01 2008 Panasonic Corporation IC memory card
D639812, May 17 2010 Panasonic Corporation Memory card
D648290, Jun 08 2010 Miyoshi Electronics Corporation Semiconductor device
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D681640, Dec 03 2010 Sony Computer Entertainment Inc Storage medium
D717254, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D729250, Jul 30 2013 Samsung Electronics Co., Ltd. Semiconductor memory device
D777124, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D796978, Mar 24 2016 Advantest Corporation Socket for electronic device testing apparatus
D814473, Jan 19 2016 Sony Corporation Memory card
D839220, Feb 19 2013 Sony Corporation Semiconductor device
D845921, May 02 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864884, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D873227, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
JP1175801,
JP1175802,
JP1178923,
JP1178924,
JP1349185,
JP1407202,
JP1621567,
KR300617530,
KR300617531,
KR300720310,
KR300750857,
KR3007508571,
////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 24 2019KONDO, ATSUSHITOSHIBA MEMORY CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0496120598 pdf
Apr 24 2019NISHIYAMA, TAKUTOSHIBA MEMORY CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0496120598 pdf
Apr 24 2019WATANABE, KATSUYOSHITOSHIBA MEMORY CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0496120598 pdf
Apr 24 2019KONDO, ATSUSHITOSHIBA MEMORY CORPORATIONCORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 049612 FRAME 0598 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 0497600855 pdf
Apr 24 2019NISHIYAMA, TAKUTOSHIBA MEMORY CORPORATIONCORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 049612 FRAME 0598 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 0497600855 pdf
Apr 24 2019WATANABE, KATSUYOSHITOSHIBA MEMORY CORPORATIONCORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 049612 FRAME 0598 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 0497600855 pdf
Jun 27 2019TOSHIBA MEMORY CORPORATION(assignment on the face of the patent)
Oct 01 2019TOSHIBA MEMORY CORPORATIONKioxia CorporationCHANGE OF NAME SEE DOCUMENT FOR DETAILS 0518420627 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule