Patent
   D783550
Priority
Sep 29 2014
Filed
Jun 20 2016
Issued
Apr 11 2017
Expiry
Apr 11 2032
Assg.orig
Entity
unknown
37
46
n/a
The ornamental design for a power semiconductor device, as shown and described.

FIG. 1 is a front, right side, bottom perspective view of a power semiconductor device, showing our new design;

FIG. 2 is another rear, left side, and top perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.

Kawafuji, Hisashi, Kato, Masahiro, Nakagawa, Shinya, Hasegawa, Maki, Iwagami, Toru

Patent Priority Assignee Title
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D903613, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
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D913978, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D914621, May 14 2019 Rohm Co., Ltd. Packaged semiconductor module
D920264, Nov 27 2019 The Noco Company Semiconductor device
D932452, Nov 27 2019 The Noco Company Semiconductor device
D933618, Oct 31 2018 Asahi Kasei Microdevices Corporation Semiconductor module
D954666, May 03 2019 LUMILEDS HOLDING B.V.; LUMILEDS HOLDING B V Flexible circuit board
D971863, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D972516, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D973029, Dec 15 2020 Rohm Co., Ltd. Semiconductor device
D981356, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
ER1452,
ER260,
ER3437,
ER4320,
ER4634,
ER4796,
ER5999,
ER7497,
ER8377,
ER9811,
Patent Priority Assignee Title
3602846,
3762039,
3825876,
3846734,
4663833, May 14 1984 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
20010038143,
20030042584,
20100149774,
D288922, Apr 19 1984 SGS-Thomson Microelectronics, Inc Zero power random access memory package
D357672, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D358806, Sep 24 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D394244, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D418485, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D448739, Sep 12 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459705, Mar 06 2001 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
D470825, Dec 28 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D472530, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505399, Mar 14 2003 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505400, Mar 26 2004 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D712853, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D717253, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717254, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717255, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717256, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719113, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D719926, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D721340, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D772182, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 04 2014HASEGAWA, MAKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570617 pdf
Sep 04 2014KATO, MASAHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570617 pdf
Sep 04 2014NAKAGAWA, SHINYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570617 pdf
Sep 04 2014KAWAFUJI, HISASHIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570617 pdf
Sep 04 2014IWAGAMI, TORUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570617 pdf
Jun 20 2016Mitsubishi Electric Corporation(assignment on the face of the patent)
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