Patent
   D421969
Priority
Sep 29 1998
Filed
Feb 17 1999
Issued
Mar 28 2000
Expiry
Mar 28 2014
Assg.orig
Entity
unknown
34
8
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front elevational view of a semiconductor device, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7-7 in FIG. 1;

FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8-8 in FIG. 1; and,

FIG. 9 is a front, right side and bottom perspective view thereof.

Majumdar, Gourab, Kawafuji, Hisashi, Shinohara, Toshiaki, Iwasaki, Mitsutaka

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Patent Priority Assignee Title
5089929, Mar 08 1990 U S INTELCO NETWORKS, INC Retrofit integrated circuit terminal protection device
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D360619, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D394244, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D396213, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D397092, Jan 03 1997 Fujitsu Limited Integrated circuit package
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 27 1999KAWAFUJI, HISASHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097870163 pdf
Jan 28 1999SHINOHARA, TOSHIAKIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097870163 pdf
Jan 30 1999IWASAKI, MITSUTAKAMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097870163 pdf
Jan 30 1999MAJUMDAR, GOURABMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0097870163 pdf
Feb 17 1999Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
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