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The ornamental design for semiconductor device, as shown.
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FIG. 1 is a top, rear, right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a one side view thereof;
FIG. 5 is the opposite side view thereof;
FIG. 6 is a rear view thereof; and,
FIG. 7 is a front view thereof.
Suzuki, Takeshi, Saito, Hidefumi, Kawaguchi, Atsushi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 09 2003 | Sanyo Electric Co., Ltd. | (assignment on the face of the patent) | / | |||
Oct 07 2003 | KAWAGUCHI, ATSUSHI | SANYO ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014715 | /0534 | |
Oct 07 2003 | SUZUKI, TAKESHI | SANYO ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014715 | /0534 | |
Oct 07 2003 | SAITO, HIDEFUMI | SANYO ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014715 | /0534 |
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