Patent
   D504405
Priority
Jul 09 2003
Filed
Jul 09 2003
Issued
Apr 26 2005
Expiry
Apr 26 2019
Assg.orig
Entity
unknown
5
4
n/a
The ornamental design for semiconductor device, as shown.

FIG. 1 is a top, rear, right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a one side view thereof;

FIG. 5 is the opposite side view thereof;

FIG. 6 is a rear view thereof; and,

FIG. 7 is a front view thereof.

Suzuki, Takeshi, Saito, Hidefumi, Kawaguchi, Atsushi

Patent Priority Assignee Title
D594488, Apr 20 2007 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D694724, Oct 03 2012 HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD Semiconductor device
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
D714745, Feb 14 2012 Panasonic Corporation Semiconductor
D776801, Jun 24 2014 Kobe Steel, Ltd Heat exchanger tube
Patent Priority Assignee Title
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D470463, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D470824, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 09 2003Sanyo Electric Co., Ltd.(assignment on the face of the patent)
Oct 07 2003KAWAGUCHI, ATSUSHISANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147150534 pdf
Oct 07 2003SUZUKI, TAKESHISANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147150534 pdf
Oct 07 2003SAITO, HIDEFUMISANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147150534 pdf
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