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Patent
D594488
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Priority
Apr 20 2007
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Filed
Oct 12 2007
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Issued
Jun 16 2009
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Expiry
Jun 16 2023
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Assg.orig
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Entity
unknown
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17
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16
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n/a
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The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.
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FIG. 1 is a front view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;
FIG. 2 is a rear view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a front perspective view thereof.
The broken line showings are for the purpose of illustrating environmental structure and forms no part of the claimed design.
Inoue, Hisashi, Toiya, Masataka, Mizuno, Yoshikatsu
| Patent |
Priority |
Assignee |
Title |
| D618638, |
May 09 2008 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D711843, |
Jun 28 2013 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D719114, |
Jun 28 2013 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D720707, |
Jun 28 2013 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D725055, |
Jun 28 2013 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D739832, |
Jun 28 2013 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D770993, |
Sep 04 2015 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| D986826, |
Mar 10 2020 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
| ER3440, |
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| ER5461, |
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| ER707, |
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| ER7131, |
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| ER7251, |
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| ER7371, |
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| ER7687, |
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| ER8469, |
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| ER9216, |
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| Patent |
Priority |
Assignee |
Title |
| 5711436, |
Feb 15 1995 |
Scanwood |
Combination drinking glass and wine glass rack |
| 5948300, |
Sep 12 1997 |
Kokusai Semiconductor Equipment Corporation |
Process tube with in-situ gas preheating |
| 20080132079, |
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| D404368, |
Aug 20 1997 |
Tokyo Electron Limited |
Outer tube for use in a semiconductor wafer heat processing apparatus |
| D405062, |
Aug 20 1997 |
Tokyo Electron Limited |
Processing tube for use in a semiconductor wafer heat processing apparatus |
| D405429, |
Jan 31 1997 |
Tokyo Electron Limited |
Processing tube for use in a semiconductor wafer heat processing apparatus |
| D405431, |
Aug 20 1997 |
Tokyo Electron Limited |
Tube for use in a semiconductor wafer heat processing apparatus |
| D406113, |
Jan 31 1997 |
Tokyo Electron Limited |
Processing tube for use in a semiconductor wafer heat processing apparatus |
| D423463, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz process tube |
| D424024, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz process tube |
| D452220, |
Oct 15 1998 |
Meto International GmbH |
Arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element |
| D504405, |
Jul 09 2003 |
SANYO ELECTRIC CO , LTD |
Semiconductor device |
| D520467, |
Nov 04 2003 |
Tokyo Electron Limited |
Process tube for semiconductor device manufacturing apparatus |
| D521464, |
Nov 04 2003 |
Tokyo Electron Limited |
Process tube for semiconductor device manufacturing apparatus |
| D568838, |
May 01 2006 |
Nitto Denko Corporation |
Grooves formed around a semiconductor device on a circuit board |
| D586768, |
Oct 12 2006 |
Tokyo Electron Limited |
Process tube for manufacturing semiconductor wafers |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a