Patent
   D594488
Priority
Apr 20 2007
Filed
Oct 12 2007
Issued
Jun 16 2009
Expiry
Jun 16 2023
Assg.orig
Entity
unknown
8
16
n/a
The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is a front view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a front perspective view thereof.

The broken line showings are for the purpose of illustrating environmental structure and forms no part of the claimed design.

Inoue, Hisashi, Toiya, Masataka, Mizuno, Yoshikatsu

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Patent Priority Assignee Title
5711436, Feb 15 1995 Scanwood Combination drinking glass and wine glass rack
5948300, Sep 12 1997 Kokusai Semiconductor Equipment Corporation Process tube with in-situ gas preheating
20080132079,
D404368, Aug 20 1997 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
D405062, Aug 20 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D405429, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D405431, Aug 20 1997 Tokyo Electron Limited Tube for use in a semiconductor wafer heat processing apparatus
D406113, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D423463, Jan 31 1997 Tokyo Electron Limited Quartz process tube
D424024, Jan 31 1997 Tokyo Electron Limited Quartz process tube
D452220, Oct 15 1998 Meto International GmbH Arrangement of aluminum foil coils forming an inductor of a resonant frequency identification element
D504405, Jul 09 2003 SANYO ELECTRIC CO , LTD Semiconductor device
D520467, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D521464, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D568838, May 01 2006 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D586768, Oct 12 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 25 2007TOIYA, MASATAKATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0200140299 pdf
Sep 28 2007MIZUNO, YOSHIKATSUTokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0200140299 pdf
Oct 01 2007INOUE, HISASHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0200140299 pdf
Oct 12 2007Tokyo Electron Limited(assignment on the face of the patent)
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