Patent
   D404368
Priority
Aug 20 1997
Filed
Feb 02 1998
Issued
Jan 19 1999
Expiry
Jan 19 2013
Assg.orig
Entity
unknown
24
10
n/a
I claim the ornamental design for an outertube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a outertube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof;

FIG. 4 a bottom plan view thereof; and,

FIG. 5 a cross-sectional view taken along line V-V in FIG. 3 .

Shimazu, Tomohisa

Patent Priority Assignee Title
D586768, Oct 12 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D590359, Feb 20 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers or the like
D594488, Apr 20 2007 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D600659, Sep 12 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D611013, Mar 28 2008 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D711843, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D719114, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D720308, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D720309, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D720707, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D724551, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D725053, Nov 18 2011 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
D725055, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D739832, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D742339, Mar 12 2014 KOKUSAI ELECTRIC CORPORATION Reaction tube
D748594, Mar 12 2014 KOKUSAI ELECTRIC CORPORATION Reaction tube
D770993, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D813210, Jun 23 2016 VOXX International Corporation Antenna housing
D813941, Mar 09 2015 NATURAL MACHINES, INC Capsule for dispensing flowable 3D printing medium
D842823, Aug 10 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D842824, Aug 09 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D845936, Jun 23 2016 VOXX International Corporation Antenna housing
D853979, Dec 27 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D901406, Mar 20 2019 KOKUSAI ELECTRIC CORPORATION Inner tube of reactor for semiconductor fabrication
Patent Priority Assignee Title
4587689, Jan 12 1983 Meat packing apparatus
5046909, Jun 29 1989 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
5314574, Jun 26 1992 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
5320218, Apr 07 1992 MURATEC AUTOMATION CO , LTD Closed container to be used in a clean room
5407449, Mar 10 1992 ASM INTERNATIONAL N V Device for treating micro-circuit wafers
5516732, Dec 04 1992 Tokyo Electron Limited Wafer processing machine vacuum front end method and apparatus
5518360, Nov 16 1990 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
5536128, Oct 21 1988 Renesas Electronics Corporation Method and apparatus for carrying a variety of products
5658115, Sep 05 1991 Hitachi, Ltd. Transfer apparatus
5752796, Jan 24 1996 Brooks Automation, Inc Vacuum integrated SMIF system
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 02 1998Tokyo Electron Limited(assignment on the face of the patent)
Apr 15 1998SHIMAZU, TOMOHISATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0091520905 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule