Patent
   D720309
Priority
Nov 18 2011
Filed
May 10 2012
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
11
28
n/a
The ornamental design for an inner tube for process tube for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is perspective view of an inner tube for process tube for manufacturing semiconductor wafers showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6;

FIG. 9 is an enlarged view of portion 9 encircled in FIG. 8;

FIG. 10 is another front view thereof, shown in a used condition; and,

FIG. 11 is an enlarged view of portion 11 encircled in FIG. 5.

The broken lines shown in the drawings represent portions of the inner tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.

Endo, Atsushi, Kaneko, Hirofumi

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 07 2012ENDO, ATSUSHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281870430 pdf
May 09 2012KANEKO, HIROFUMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281870430 pdf
May 10 2012Tokyo Electron Limited(assignment on the face of the patent)
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