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I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof;
FIG. 5 a cross sectional view thereof taken along line V--V in FIG. 2;
FIG. 6 a rear elevational view thereof;
FIG. 7 a left side view thereof;
FIG. 8 a right side view thereof;
FIG. 9 a cross sectional view thereof taken along line IX--IX in FIG. 3; and,
FIG. 10 a cross sectional view thereof taken along line X--X in FIG. 3.
Watanabe, Shingo, Hanagata, Tetsuya
Patent | Priority | Assignee | Title |
D586768, | Oct 12 2006 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
D590359, | Feb 20 2006 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers or the like |
D594488, | Apr 20 2007 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
D600659, | Sep 12 2006 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
D610559, | May 30 2008 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D619630, | May 08 2007 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
D711843, | Jun 28 2013 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D719114, | Jun 28 2013 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D720308, | Nov 18 2011 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
D720309, | Nov 18 2011 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
D720707, | Jun 28 2013 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D724551, | Nov 18 2011 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
D725053, | Nov 18 2011 | Tokyo Electron Limited | Outer tube for process tube for manufacturing semiconductor wafers |
D725055, | Jun 28 2013 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D739832, | Jun 28 2013 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D742339, | Mar 12 2014 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D748594, | Mar 12 2014 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D770993, | Sep 04 2015 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D772824, | Feb 25 2015 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D790490, | Sep 04 2015 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D791090, | Sep 04 2015 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D842823, | Aug 10 2017 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D842824, | Aug 09 2017 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D853979, | Dec 27 2017 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
D901406, | Mar 20 2019 | KOKUSAI ELECTRIC CORPORATION | Inner tube of reactor for semiconductor fabrication |
D931823, | Jan 29 2020 | KOKUSAI ELECTRIC CORPORATION | Reaction tube |
ER8469, |
Patent | Priority | Assignee | Title |
4587689, | Jan 12 1983 | Meat packing apparatus | |
5046909, | Jun 29 1989 | Applied Materials, Inc. | Method and apparatus for handling semiconductor wafers |
5314574, | Jun 26 1992 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
5320218, | Apr 07 1992 | MURATEC AUTOMATION CO , LTD | Closed container to be used in a clean room |
5407449, | Mar 10 1992 | ASM INTERNATIONAL N V | Device for treating micro-circuit wafers |
5516732, | Dec 04 1992 | Tokyo Electron Limited | Wafer processing machine vacuum front end method and apparatus |
5518360, | Nov 16 1990 | Kabushiki-Kaisha Watanabe Shoko | Wafer carrying device and wafer carrying method |
5536128, | Oct 21 1988 | Renesas Electronics Corporation | Method and apparatus for carrying a variety of products |
5658115, | Sep 05 1991 | Hitachi, Ltd. | Transfer apparatus |
5752796, | Jan 24 1996 | Brooks Automation, Inc | Vacuum integrated SMIF system |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 24 1997 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Nov 07 1997 | HANAGATA, TETSUYA | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008847 | /0597 | |
Nov 07 1997 | WATANABE, SHINGO | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008847 | /0597 |
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