Patent
   D590359
Priority
Feb 20 2006
Filed
Aug 18 2006
Issued
Apr 14 2009
Expiry
Apr 14 2023
Assg.orig
Entity
unknown
2
13
n/a
The ornamental design for a process tube for manufacturing semiconductor wafers or the like, as shown and described.

FIG. 1 is a front elevational view of the process tube for manufacturing semiconductor wafers or the like, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a left side elevational view thereof;

FIG. 7 is an enlarged cross-sectional view thereof taken along line 77 in FIG. 3

FIG. 8 is an enlarged cross-sectional view thereof taken along line 88 in FIG. 3

FIG. 9 is an enlarged cross-sectional view thereof taken along line 99 in FIG. 3

FIG. 10 is a vertical cross-sectional view thereof taken along line 1010 in FIG. 3; and,

FIG. 11 is a bottom and right side perspective view thereof shown on reduced scale.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Kaneko, Hirofumi

Patent Priority Assignee Title
D725053, Nov 18 2011 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
D853979, Dec 27 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
Patent Priority Assignee Title
5618349, Jul 24 1993 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
5948300, Sep 12 1997 Kokusai Semiconductor Equipment Corporation Process tube with in-situ gas preheating
6251189, Feb 18 1999 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus and substrate processing method
6538237, Jan 08 2002 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for holding a quartz furnace
7311520, Sep 24 2002 Tokyo Electron Limited Heat treatment apparatus
20020014483,
D404368, Aug 20 1997 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
D405062, Aug 20 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D406113, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D424024, Jan 31 1997 Tokyo Electron Limited Quartz process tube
D520467, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D521464, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D521465, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 18 2006Tokyo Electron Limited(assignment on the face of the patent)
Aug 21 2006KANEKO, HIROHUMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0183650391 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule