FIG. 1 is a front elevational view of the process tube for manufacturing semiconductor wafers or the like, showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side elevational view thereof,
FIG. 6 is a left side elevational view thereof;
FIG. 7 is an enlarged cross-sectional view thereof taken along line 7—7 in FIG. 3
FIG. 8 is an enlarged cross-sectional view thereof taken along line 8—8 in FIG. 3
FIG. 9 is an enlarged cross-sectional view thereof taken along line 9—9 in FIG. 3
FIG. 10 is a vertical cross-sectional view thereof taken along line 10—10 in FIG. 3; and,
FIG. 11 is a bottom and right side perspective view thereof shown on reduced scale.
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
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