Patent
   D725053
Priority
Nov 18 2011
Filed
May 10 2012
Issued
Mar 24 2015
Expiry
Mar 24 2029
Assg.orig
Entity
unknown
15
31
n/a
The ornamental design for an outer tube for process tube for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is perspective view of an outer tube for process tube for manufacturing semiconductor wafers showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6.

The broken lines shown in the drawings represent portions of the outer tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.

Endo, Atsushi, Kaneko, Hirofumi

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 07 2012ENDO, ATSUSHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281870310 pdf
May 09 2012KANEKO, HIROFUMITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281870310 pdf
May 10 2012Tokyo Electron Limited(assignment on the face of the patent)
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