Patent
   D405431
Priority
Aug 20 1997
Filed
Feb 05 1998
Issued
Feb 09 1999
Expiry
Feb 09 2013
Assg.orig
Entity
unknown
29
10
n/a
I claim the ornamental design for tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof;

FIG. 7 a top plan view thereof;

FIG. 8 a cross-sectional view taken along line VIII--VIII in FIG. 7; and,

FIG. 9 a left side view thereof.

Shimazu, Tomohisa

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 05 1998Tokyo Electron Ltd.(assignment on the face of the patent)
Mar 18 1998SHIMAZU, TOMOHISATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0091260600 pdf
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