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Patent
D720308
Priority
Nov 18 2011
Filed
May 10 2012
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
3
31
n/a
The ornamental design for an inner tube for process tube for manufacturing semiconductor wafers, as shown and described.
FIG. 1 is a perspective view of an inner tube for process tube for manufacturing semiconductor wafers showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an enlarged cross-sectional view taken along line 8 -8 of FIG. 2 ; and,
FIG. 9 is another front view thereof, shown in a used condition.
The broken lines shown in the drawings represent portions of the inner tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.
Endo, Atsushi , Kaneko, Hirofumi
Patent
Priority
Assignee
Title
4950870 ,
Nov 21 1987
Tokyo Electron Limited
Heat-treating apparatus
5037502 ,
Dec 29 1983
Sharp Kabushiki Kaisha
Process for producing a single-crystal substrate of silicon carbide
5352293 ,
Jan 06 1992
SAMSUNG ELECTRONICS CO , LTD
Tube apparatus for manufacturing semiconductor device
5618349 ,
Jul 24 1993
Yamaha Corporation
Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
5897311 ,
May 31 1995
Tokyo Electron Limited
Support boat for objects to be processed
5948300 ,
Sep 12 1997
Kokusai Semiconductor Equipment Corporation
Process tube with in-situ gas preheating
5968593 ,
Mar 20 1995
KOKUSAI ELECTRIC CO , LTD
Semiconductor manufacturing apparatus
6251189 ,
Feb 18 1999
KOKUSAI ELECTRIC CORPORATION
Substrate processing apparatus and substrate processing method
6402849 ,
Mar 17 2000
Samsung Electronics Co., Ltd.
Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
7311520 ,
Sep 24 2002
Tokyo Electron Limited
Heat treatment apparatus
20020014483 ,
20030221779 ,
20080083372 ,
20080132079 ,
D404368 ,
Aug 20 1997
Tokyo Electron Limited
Outer tube for use in a semiconductor wafer heat processing apparatus
D405062 ,
Aug 20 1997
Tokyo Electron Limited
Processing tube for use in a semiconductor wafer heat processing apparatus
D405429 ,
Jan 31 1997
Tokyo Electron Limited
Processing tube for use in a semiconductor wafer heat processing apparatus
D405431 ,
Aug 20 1997
Tokyo Electron Limited
Tube for use in a semiconductor wafer heat processing apparatus
D406113 ,
Jan 31 1997
Tokyo Electron Limited
Processing tube for use in a semiconductor wafer heat processing apparatus
D417438 ,
Jan 31 1997
Tokyo Electron Limited
Quartz outer tube
D423463 ,
Jan 31 1997
Tokyo Electron Limited
Quartz process tube
D424024 ,
Jan 31 1997
Tokyo Electron Limited
Quartz process tube
D521464 ,
Nov 04 2003
Tokyo Electron Limited
Process tube for semiconductor device manufacturing apparatus
D521465 ,
Nov 04 2003
Tokyo Electron Limited
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D552047 ,
Feb 28 2005
Tokyo Electron Limited
Process tube for manufacturing semiconductor wafers
D556704 ,
Aug 25 2005
HITACHI HIGH-TECH CORPORATION
Grounded electrode for a plasma processing apparatus
D586768 ,
Oct 12 2006
Tokyo Electron Limited
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D600659 ,
Sep 12 2006
Tokyo Electron Limited
Process tube for manufacturing semiconductor wafers
D611013 ,
Mar 28 2008
Tokyo Electron Limited
Process tube for manufacturing semiconductor wafers
D618638 ,
May 09 2008
KOKUSAI ELECTRIC CORPORATION
Reaction tube
D619630 ,
May 08 2007
Tokyo Electron Limited
Process tube for manufacturing semiconductor wafers
Date
Maintenance Fee Events
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Date
Maintenance Schedule
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