Patent
   D600659
Priority
Sep 12 2006
Filed
Mar 09 2007
Issued
Sep 22 2009
Expiry
Sep 22 2023
Assg.orig
Entity
unknown
27
10
n/a
The ornamental design for a process tub for manufacturing semiconductor wafers, as shown and described.

FIG. 1 is a perspective view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a sectional view thereof along line 88 of FIG. 4;

FIG. 9 is a sectional view thereof along line 99 of FIG. 4;

FIG. 10 is a sectional view thereof along line 1010 of FIG. 4; and,

FIG. 11 is a sectional view thereof along line 1111 of FIG. 2.

The broken lines are shown for illustrative purpose only and form no part of the claimed design.

Matsuura, Hiroyuki, Shimada, Koichi

Patent Priority Assignee Title
11542601, Feb 09 2016 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus and method of manufacturing semiconductor device
D618638, May 09 2008 KOKUSAI ELECTRIC CORPORATION Reaction tube
D655258, Oct 21 2010 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
D655262, Oct 21 2010 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
D711843, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D719114, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D720308, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D720309, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D720707, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D724551, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D725053, Nov 18 2011 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
D725055, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D739832, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D742339, Mar 12 2014 KOKUSAI ELECTRIC CORPORATION Reaction tube
D748594, Mar 12 2014 KOKUSAI ELECTRIC CORPORATION Reaction tube
D770993, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D772824, Feb 25 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D778457, Feb 23 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D778458, Feb 23 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D790490, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D791090, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D842823, Aug 10 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D842824, Aug 09 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D853979, Dec 27 2017 KOKUSAI ELECTRIC CORPORATION Reaction tube
D901406, Mar 20 2019 KOKUSAI ELECTRIC CORPORATION Inner tube of reactor for semiconductor fabrication
D931823, Jan 29 2020 KOKUSAI ELECTRIC CORPORATION Reaction tube
D986826, Mar 10 2020 KOKUSAI ELECTRIC CORPORATION Reaction tube
Patent Priority Assignee Title
5618349, Jul 24 1993 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
5948300, Sep 12 1997 Kokusai Semiconductor Equipment Corporation Process tube with in-situ gas preheating
6251189, Feb 18 1999 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus and substrate processing method
6538237, Jan 08 2002 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for holding a quartz furnace
20020014483,
D404368, Aug 20 1997 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
D405062, Aug 20 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D406113, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D520467, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D521464, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 09 2007Tokyo Electron Limited(assignment on the face of the patent)
Mar 13 2007SHIMADA, KOICHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0195170741 pdf
May 09 2007MATSUURA, HIROYUKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0195170741 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule