Patent
   D842823
Priority
Aug 10 2017
Filed
Jan 30 2018
Issued
Mar 12 2019
Expiry
Mar 12 2034
Assg.orig
Entity
unknown
4
36
n/a
The ornamental design for a reaction tube, as shown and described.

FIG. 1 is a front, top and right side perspective view of a reaction tube showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross sectional view take along line 8-8 in FIG. 2 thereof; and,

FIG. 9 is a cross sectional view take along line 9-9 in FIG. 2.

Sasaki, Takafumi, Yoshida, Hidenari, Okajima, Yusaku, Saido, Shuhei, Mimura, Hidetoshi

Patent Priority Assignee Title
D886318, Jun 15 2018 TENGA CO , LTD Ejaculation promotion apparatus storage container
D901406, Mar 20 2019 KOKUSAI ELECTRIC CORPORATION Inner tube of reactor for semiconductor fabrication
D931823, Jan 29 2020 KOKUSAI ELECTRIC CORPORATION Reaction tube
D986826, Mar 10 2020 KOKUSAI ELECTRIC CORPORATION Reaction tube
Patent Priority Assignee Title
4950870, Nov 21 1987 Tokyo Electron Limited Heat-treating apparatus
5618349, Jul 24 1993 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
5948300, Sep 12 1997 Kokusai Semiconductor Equipment Corporation Process tube with in-situ gas preheating
5968593, Mar 20 1995 KOKUSAI ELECTRIC CO , LTD Semiconductor manufacturing apparatus
6251189, Feb 18 1999 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus and substrate processing method
6402849, Mar 17 2000 Samsung Electronics Co., Ltd. Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device
7311520, Sep 24 2002 Tokyo Electron Limited Heat treatment apparatus
20030221779,
20070098605,
20080083372,
20090194521,
20090250005,
D404368, Aug 20 1997 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
D405062, Aug 20 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D405429, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D405431, Aug 20 1997 Tokyo Electron Limited Tube for use in a semiconductor wafer heat processing apparatus
D406113, Jan 31 1997 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
D417438, Jan 31 1997 Tokyo Electron Limited Quartz outer tube
D423463, Jan 31 1997 Tokyo Electron Limited Quartz process tube
D424024, Jan 31 1997 Tokyo Electron Limited Quartz process tube
D521464, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D521465, Nov 04 2003 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus
D586768, Oct 12 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D600659, Sep 12 2006 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D610559, May 30 2008 KOKUSAI ELECTRIC CORPORATION Reaction tube
D611013, Mar 28 2008 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
D618638, May 09 2008 KOKUSAI ELECTRIC CORPORATION Reaction tube
D711843, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D719114, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D724551, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D725055, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D739832, Jun 28 2013 KOKUSAI ELECTRIC CORPORATION Reaction tube
D770993, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D772824, Feb 25 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D791090, Sep 04 2015 KOKUSAI ELECTRIC CORPORATION Reaction tube
D800080, Mar 30 2016 Tokyo Electron Limited Reactor tube for semiconductor production devices
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 06 2017OKAJIMA, YUSAKUHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0447680342 pdf
Dec 06 2017YOSHIDA, HIDENARIHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0447680342 pdf
Dec 06 2017SAIDO, SHUHEIHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0447680342 pdf
Dec 06 2017MIMURA, HIDETOSHIHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0447680342 pdf
Dec 07 2017SASAKI, TAKAFUMIHitachi Kokusai Electric IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0447680342 pdf
Jan 30 2018KOKUSAI ELECTRIC CORPORATION(assignment on the face of the patent)
Sep 19 2018Hitachi Kokusai Electric IncKOKUSAI ELECTRIC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0469260886 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule