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We claim the ornamental design for a processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof;
FIG. 5 a cross sectional view thereof taken along line V-V in FIG. 2;
FIG. 6 a right side view thereof;
FIG. 7 a rear elevational view thereof;
FIG. 8 a left side view thereof;
FIG. 9 a cross sectional view thereof taken along line IX-IX in FIG. 3;
FIG. 10 a cross sectional view thereof taken along line X-X in FIG. 3; and,
FIG. 11 a reference figure showing the using state.
Watanabe, Shingo, Hanagata, Tetsuya
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 24 1997 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Nov 07 1997 | HANAGATA, TETSUYA | Tokyo Electron Limited | CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR S NAME PREVIOUSLY RECORDED AT REEL 8834, FRAME 0976 | 009090 | /0848 | |
Nov 07 1997 | WATANABE, SHINGO | Tokyo Electron Limited | CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR S NAME PREVIOUSLY RECORDED AT REEL 8834, FRAME 0976 | 009090 | /0848 | |
Nov 07 1997 | NANAGATA, TETSUYA | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008834 | /0976 | |
Nov 07 1997 | WATANABE, SHINGO | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008834 | /0976 |
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