Patent
   D405429
Priority
Jan 31 1997
Filed
Jul 24 1997
Issued
Feb 09 1999
Expiry
Feb 09 2013
Assg.orig
Entity
unknown
29
10
n/a
We claim the ornamental design for a processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a cross sectional view thereof taken along line V-V in FIG. 2;

FIG. 6 a right side view thereof;

FIG. 7 a rear elevational view thereof;

FIG. 8 a left side view thereof;

FIG. 9 a cross sectional view thereof taken along line IX-IX in FIG. 3;

FIG. 10 a cross sectional view thereof taken along line X-X in FIG. 3; and,

FIG. 11 a reference figure showing the using state.

Watanabe, Shingo, Hanagata, Tetsuya

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D901406, Mar 20 2019 KOKUSAI ELECTRIC CORPORATION Inner tube of reactor for semiconductor fabrication
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ER1824,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 1997Tokyo Electron Limited(assignment on the face of the patent)
Nov 07 1997HANAGATA, TETSUYATokyo Electron LimitedCORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR S NAME PREVIOUSLY RECORDED AT REEL 8834, FRAME 0976 0090900848 pdf
Nov 07 1997WATANABE, SHINGOTokyo Electron LimitedCORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR S NAME PREVIOUSLY RECORDED AT REEL 8834, FRAME 0976 0090900848 pdf
Nov 07 1997NANAGATA, TETSUYATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0088340976 pdf
Nov 07 1997WATANABE, SHINGOTokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0088340976 pdf
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