Patent
   D654883
Priority
Oct 21 2010
Filed
Apr 13 2011
Issued
Feb 28 2012
Expiry
Feb 28 2026
Assg.orig
Entity
unknown
21
6
n/a
The ornamental design for top plate for reactor for manufacturing semiconductor, as shown and described.

FIG. 1 is front perspective view of a top plate for reactor for manufacturing semiconductor illustrating our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a reference front view indicating the plane upon which a sectional view is taken; and,

FIG. 9 is a sectional view taken along line 9-9-9 of FIG. 8.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Honma, Manabu, Hishiya, Katsuyuki

Patent Priority Assignee Title
10344382, May 16 2014 Tokyo Electron Limited Film forming apparatus
10508340, Mar 15 2013 Applied Materials, Inc Atmospheric lid with rigid plate for carousel processing chambers
D689032, Apr 21 2011 Panasonic Corporation Electrostatic atomized water particle generating module
D694790, Sep 20 2011 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
D697038, Sep 20 2011 Tokyo Electron Limited Baffle plate
D699199, Sep 30 2011 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
D699200, Sep 30 2011 Tokyo Electron Limited Electrode member for a plasma processing apparatus
D703161, Oct 15 2012 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
D703162, Oct 17 2012 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
D709536, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709537, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709538, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709539, Sep 30 2011 Tokyo Electron Limited Focusing ring
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D720309, Nov 18 2011 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
D722031, Dec 31 2013 CELADON SYSTEMS, INC Top contact layout board in an electrical system
D724553, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D766850, Mar 28 2014 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
D916037, May 18 2018 KOKUSAI ELECTRIC CORPORATION Cover of seal cap for reaction chamber for semiconductor
D924823, Jul 19 2018 KOKUSAI ELECTRIC CORPORATION Adiabatic plate for substrate processing apparatus
D981972, Mar 22 2021 KOKUSAI ELECTRIC CORPORATION Adiabatic plate for substrate processing appratus
Patent Priority Assignee Title
7235139, Oct 28 2003 Veeco Instruments INC Wafer carrier for growing GaN wafers
D614593, Jul 21 2008 ASM KOREA LTD Substrate support for a semiconductor deposition apparatus
D615937, Mar 06 2009 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
D616392, Mar 06 2009 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
D616393, Mar 06 2009 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
D639757, Aug 16 2010 CELADON SYSTEMS, INC Top contact layout board in an electrical system
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 13 2011Tokyo Electron Limited(assignment on the face of the patent)
May 17 2011HONMA, MANABUTokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263600184 pdf
May 17 2011HISHIYA, KATSUYUKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0263600184 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule