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Patent
   D722031
Priority
Dec 31 2013
Filed
Dec 31 2013
Issued
Feb 03 2015
Expiry
Feb 03 2029
Inventors
Root, Brya…
Assg.orig
Celadon Sy…
Assg.curr
CELADON SY…
Entity
unknown
Referenced by
0
References
21
Maint.:
n/a
The ornamental design for a top contact layout board in an electrical system, as shown and described.

FIG. 1 is an enlarged front view of a top contact layout board in an electrical system showing our new design, the motherboard is shown in broken lines as unclaimed environment and forms no part of the claimed design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.
INVENTORS:

Root, Bryan J., Dunklee, John L., Funk, William A., Page, Matthew, Flanders, Dennis

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
3795845,
5091822, Jun 15 1989 Graphico Co., Ltd. Radial type of parallel system bus structure with printed, twisted conductor lines
5210682, Oct 19 1990 Graphico Co., Ltd. Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements
5491364, Aug 31 1994 Delphi Technologies, Inc Reduced stress terminal pattern for integrated circuit devices and packages
6310398, Dec 03 1998 Walter M., Katz Routable high-density interfaces for integrated circuit devices
6556454, Oct 31 2000 III Holdings 1, LLC High density contact arrangement
6664620, Jun 29 1999 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
6793500, Sep 18 2003 International Business Machines Corporation Radial contact pad footprint and wiring for electrical components
20020060318,
225434,
D320361, Jun 02 1989 Tokyo Electron Limited Wafer probe plate holder
D616389, Oct 20 2008 Ebara Corporation Vacuum contact pad
D639755, Jan 20 2010 CELADON SYSTEMS, INC Top contact layout board in an electrical system
D639757, Aug 16 2010 CELADON SYSTEMS, INC Top contact layout board in an electrical system
D649126, Oct 20 2008 Ebara Corporation Vacuum contact pad
D654033, Jan 20 2010 CELADON SYSTEMS, INC Grooved wire support for a probe test core
D654883, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D654884, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655257, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655259, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D664249, Jul 01 2011 Applied Materials, Inc Flow blocker plate
ASSIGNMENT RECORDS    Assignment records on the USPTO
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 31 2013Celadon Systems, Inc.(assignment on the face of the patent)
Jan 10 2014DUNKLEE, JOHN L CELADON SYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0322780747 pdf
Jan 10 2014FUNK, WILLIAM A CELADON SYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0322780747 pdf
Jan 10 2014PAGE, MATTHEWCELADON SYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0322780747 pdf
Jan 10 2014ROOT, BRYAN J CELADON SYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0322780747 pdf
Jan 13 2014FLANDERS, DENNISCELADON SYSTEMS, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0322780747 pdf
Nov 25 2015CELADON SYSTEMS, INC CELADON SYSTEMS, INC CHANGE OF ADDRESS0419120980 pdf
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