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Patent
D639757
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Priority
Aug 16 2010
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Filed
Aug 16 2010
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Issued
Jun 14 2011
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Expiry
Jun 14 2025
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Assg.orig
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Entity
unknown
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15
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15
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n/a
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The ornamental design for a top contact layout board in an electrical system, as shown and described.
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FIG. 1 is a front view of a top contact layout board in an electrical system.
FIG. 2 is a side view taken from the left of FIG. 1.
FIG. 3 is a side view taken from the right of FIG. 1.
FIG. 4 is a side view taken from the top of FIG. 1.
FIG. 5 is a side view taken from the bottom of FIG. 1; and,
FIG. 6 is a rear view taken from the opposite of the front view shown in FIG. 1.
The broken lines shown in FIGS. 1 and 6 views are for illustrative purposes only and form no part of the claimed design.
Root, Bryan J., Funk, William A.
Patent |
Priority |
Assignee |
Title |
D654033, |
Jan 20 2010 |
CELADON SYSTEMS, INC |
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D697038, |
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D703161, |
Oct 15 2012 |
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D703162, |
Oct 17 2012 |
Sumitomo Electric Industries, Ltd. |
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D713363, |
Dec 31 2013 |
CELADON SYSTEMS, INC |
Support for a probe test core |
D722031, |
Dec 31 2013 |
CELADON SYSTEMS, INC |
Top contact layout board in an electrical system |
D913256, |
Jul 31 2019 |
|
Antenna pattern for a semiconductive substrate carrier |
D926716, |
Jul 31 2019 |
|
Antenna pattern for a semiconductive substrate carrier |
Patent |
Priority |
Assignee |
Title |
3795845, |
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|
|
4495377, |
Dec 30 1982 |
International Business Machines Corporation |
Substrate wiring patterns for connecting to integrated-circuit chips |
5091822, |
Jun 15 1989 |
Graphico Co., Ltd. |
Radial type of parallel system bus structure with printed, twisted conductor lines |
5210682, |
Oct 19 1990 |
Graphico Co., Ltd. |
Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements |
5491364, |
Aug 31 1994 |
Delphi Technologies, Inc |
Reduced stress terminal pattern for integrated circuit devices and packages |
6160716, |
Sep 08 1997 |
Rambus Inc |
Motherboard having one-between trace connections for connectors |
6310398, |
Dec 03 1998 |
Walter M., Katz |
Routable high-density interfaces for integrated circuit devices |
6556454, |
Oct 31 2000 |
III Holdings 1, LLC |
High density contact arrangement |
6664620, |
Jun 29 1999 |
Intel Corporation |
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
6793500, |
Sep 18 2003 |
International Business Machines Corporation |
Radial contact pad footprint and wiring for electrical components |
7808110, |
Feb 01 2007 |
Siliconware Precision Industries Co., Ltd. |
Semiconductor package substrate |
20020060318, |
|
|
|
225434, |
|
|
|
D320361, |
Jun 02 1989 |
Tokyo Electron Limited |
Wafer probe plate holder |
D552048, |
Oct 26 2005 |
Hon Hai Precision Industry Co., Ltd. |
Printed circuit board |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a