Patent
   D703162
Priority
Oct 17 2012
Filed
Mar 13 2013
Issued
Apr 22 2014
Expiry
Apr 22 2028
Assg.orig
Entity
unknown
27
22
n/a
The ornamental design for a wafer holder for a stepper, as shown and described.

FIG. 1 is a front view of a wafer holder for a stepper showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front perspective view thereof, wherein each of the three pins leans toward the center of the holder;

FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 3;

FIG. 9 is an enlarged portion view taken along line 9-9 of FIG. 6;

FIG. 10 is an enlarged portion view taken along line 10-10 of FIG. 5; and,

FIG. 11 is an enlarged portion view taken along line 11-11 of FIG. 1.

The broken lines shown in the drawings represent portions of the wafer holder for a stepper that form no part of the claimed design.

Tamaso, Hideto

Patent Priority Assignee Title
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D723077, Dec 03 2013 Applied Materials, Inc Chuck carrier film
D724553, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D760180, Feb 21 2014 HZO, INC Hexcell channel arrangement for use in a boat for a deposition apparatus
D766850, Mar 28 2014 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
D784937, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D785576, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D786810, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D793971, Mar 27 2015 Veeco Instruments INC Wafer carrier with a 14-pocket configuration
D793972, Mar 27 2015 Veeco Instruments INC Wafer carrier with a 31-pocket configuration
D806046, Apr 16 2015 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
D852762, Mar 27 2015 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
D873782, May 17 2016 Electro Scientific Industries, Inc Component carrier plate
D894137, Oct 05 2017 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D902165, Mar 09 2018 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D908645, Aug 26 2019 Applied Materials, Inc Sputtering target for a physical vapor deposition chamber
D933725, Feb 08 2019 Applied Materials, Inc Deposition ring for a substrate processing chamber
D937329, Mar 23 2020 Applied Materials, Inc Sputter target for a physical vapor deposition chamber
D940765, Dec 02 2020 Applied Materials, Inc Target profile for a physical vapor deposition chamber target
D941371, Mar 20 2020 Applied Materials, Inc Process shield for a substrate processing chamber
D941372, Mar 20 2020 Applied Materials, Inc Process shield for a substrate processing chamber
D942516, Feb 08 2019 Applied Materials, Inc Process shield for a substrate processing chamber
D946638, Dec 11 2017 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D947802, May 20 2020 Applied Materials, Inc Replaceable substrate carrier interfacing film
D966357, Dec 02 2020 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D970566, Mar 23 2020 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
ER6877,
Patent Priority Assignee Title
5310339, Sep 26 1990 Tokyo Electron Limited Heat treatment apparatus having a wafer boat
6095806, Jun 24 1998 Tokyo Electron Limited; Kabushiki Kaisha Toshiba Semiconductor wafer boat and vertical heat treating system
7100954, Jul 11 2003 TEL NEXX, INC Ultra-thin wafer handling system
7644968, Jan 23 2004 Kawasaki Jukogyo Kabushiki Kaisha Substrate holding device
D320361, Jun 02 1989 Tokyo Electron Limited Wafer probe plate holder
D544452, Sep 08 2005 BISSEL INC ; BISSELL INC Supporting plate
D552565, Sep 08 2005 TOKYO OHKA KOGYO CO , LTD Supporting plate
D583779, Jul 13 2006 Ebara Corporation Electrolytic plating anode
D589474, Dec 06 2007 Tokyo Electron Limited Wafer holding member
D589912, Jun 06 2007 Tokyo Electron Limited Wafer holding member
D606952, Jan 16 2009 ASM KOREA LTD Plasma inducing plate for semiconductor deposition apparatus
D609652, Jul 22 2008 Tokyo Electron Limited Wafer attracting plate
D614593, Jul 21 2008 ASM KOREA LTD Substrate support for a semiconductor deposition apparatus
D616394, Mar 06 2009 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
D639757, Aug 16 2010 CELADON SYSTEMS, INC Top contact layout board in an electrical system
D654883, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D654884, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655257, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655259, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D674366, Jan 20 2011 Tokyo Electron Limited Wafer holding member
D674761, Oct 20 2011 Tokyo Electron Limited Wafer holding member
D684551, Jul 07 2011 Wafer polishing pad holder
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 27 2013TAMASO, HIDETOSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0299830086 pdf
Mar 13 2013Sumitomo Electric Industries, Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule