PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D947802
|
Priority
May 20 2020
|
Filed
May 20 2020
|
Issued
Apr 05 2022
|
Expiry
Apr 05 2037
|
|
Assg.orig
|
|
Entity
unknown
|
6
|
40
|
n/a
|
|
|
The ornamental design for a replaceable substrate carrier interfacing film, as shown and described.
|
FIG. 1 is a top perspective view of a replaceable substrate carrier interfacing film;
FIG. 2 is a bottom perspective view of the replaceable substrate carrier interfacing film;
FIG. 3 is a top plan view of the replaceable substrate carrier interfacing film;
FIG. 4 is a bottom plan view of the replaceable substrate carrier interfacing film;
FIG. 5 is a front side view of the replaceable substrate carrier interfacing film;
FIG. 6 is a right side view of the replaceable substrate carrier interfacing film;
FIG. 7 is a left side view of the replaceable substrate carrier interfacing film;
FIG. 8 is a back side view of the replaceable substrate carrier interfacing film; and,
FIG. 9 is close up view of a portion of the replaceable substrate carrier interfacing film of FIG. 1.
Golubovsky, Edward, Sakata, Clinton
Patent |
Priority |
Assignee |
Title |
5620525, |
Jul 16 1990 |
Novellus Systems, Inc |
Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
6507006, |
Feb 25 2000 |
Ibiden Co., Ltd. |
Ceramic substrate and process for producing the same |
6837774, |
Mar 28 2001 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
7025664, |
Mar 31 2000 |
Novellus Systems, Inc |
Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
8157615, |
Apr 12 2008 |
|
Device and process for applying and/or detaching a wafer to/from a carrier |
20030089975, |
|
|
|
20030119431, |
|
|
|
20060002053, |
|
|
|
20120168040, |
|
|
|
20130306215, |
|
|
|
20140191478, |
|
|
|
20190148125, |
|
|
|
20190221455, |
|
|
|
20210035828, |
|
|
|
20210183685, |
|
|
|
D420022, |
May 08 1996 |
Applied Materials, Inc. |
Electrostatic chuck with improved spacing and charge migration reduction mask |
D420023, |
Nov 14 1997 |
Applied Materials, Inc. |
Electrostatic chuck with improved spacing mask and workpiece detection device |
D425919, |
Nov 14 1997 |
Applied Materials, Inc |
Electrostatic chuck with improved spacing mask and workpiece detection device |
D489739, |
Dec 20 2002 |
NGK SPARK PLUG CO , LTD |
Electrostatic chuck |
D490096, |
Dec 20 2002 |
NGK SPARK PLUG CO , LTD |
Electrostatic chuck |
D490827, |
Dec 20 2002 |
NGK SPARK PLUG CO , LTD |
Electrostatic chuck |
D497171, |
Dec 20 2002 |
NGK SPARK PLUG CO , LTD |
Electrostatic chuck |
D546784, |
Sep 29 2005 |
Tokyo Electron Limited |
Attracting disc for an electrostatic chuck for semiconductor production |
D548705, |
Sep 29 2005 |
Tokyo Electron Limited |
Attracting disc for an electrostatic chuck for semiconductor production |
D561206, |
Nov 25 2005 |
MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC |
Electrostatic chuck |
D587222, |
Aug 01 2006 |
Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD |
Attracting plate of an electrostatic chuck for semiconductor manufacturing |
D609655, |
Oct 03 2008 |
NGK Insulators, Ltd. |
Electrostatic chuck |
D616389, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D649126, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D650344, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D687791, |
Mar 20 2012 |
Veeco Instruments INC |
Multi-keyed wafer carrier |
D703162, |
Oct 17 2012 |
Sumitomo Electric Industries, Ltd. |
Wafer holder for stepper |
D708651, |
Nov 22 2011 |
Applied Materials, Inc |
Electrostatic chuck |
D723077, |
Dec 03 2013 |
Applied Materials, Inc |
Chuck carrier film |
D769200, |
May 15 2013 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D825505, |
Jun 18 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D836572, |
Sep 30 2016 |
Applied Materials, Inc.; Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D837755, |
Apr 16 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D859331, |
Mar 31 2017 |
Ebara Corporation |
Vacuum contact pad |
D859332, |
Jun 29 2017 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a