Patent
   D708651
Priority
Nov 22 2011
Filed
Nov 22 2011
Issued
Jul 08 2014
Expiry
Jul 08 2028
Assg.orig
Entity
unknown
4
20
n/a
The ornamental design for an electrostatic chuck, as shown and described.

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a perspective view of an electrostatic chuck.

FIG. 2 is a top plan view of the electrostatic chuck of FIG. 1.

FIG. 3 is a front side view of the electrostatic chuck of FIG. 1, the other sides being identical.

FIG. 4 is a bottom plan view of the electrostatic chuck of FIG. 1.

FIG. 5 is a cross-sectional view of the electrostatic chuck of FIG. 1 taken along section line 5-5 of FIG. 4.

FIG. 6 is an enlarged partial view of FIG. 5.

FIG. 7 is an enlarged partial view of FIG. 1.

FIG. 8 is a color photograph illustrating the electrostatic chuck of FIG. 2 from a top view; and,

FIG. 9 is color photograph illustrating the electrostatic chuck of FIG. 1 from a perspective view.

The broken lines in the figures form no part of the claimed design.

The drawings are lined for color. The pattern on the surface of the claimed design represents the color copper.

Martin, Daniel, Agarwal, Monika

Patent Priority Assignee Title
D845770, Jan 10 2017 ROCKWOOD & HINES GLASS GROUP CO LTD Bottle
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D947802, May 20 2020 Applied Materials, Inc Replaceable substrate carrier interfacing film
Patent Priority Assignee Title
4724510, Dec 12 1986 MOTOROLA, INC , A DE CORP Electrostatic wafer clamp
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5382311, Dec 17 1992 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
5530616, Nov 29 1993 Toto Ltd.; Anelva Co. Electrostastic chuck
5539609, Dec 02 1992 Applied Materials, Inc Electrostatic chuck usable in high density plasma
5671117, Feb 28 1994 Applied Materials Inc. Electrostatic chuck
5822171, Feb 22 1994 Applied Materials, Inc Electrostatic chuck with improved erosion resistance
5883778, Feb 28 1994 Applied Materials Inc Electrostatic chuck with fluid flow regulator
6028762, Jan 31 1996 Kyocera Corporation Electrostatic chuck
6215642, Mar 11 1999 Nikon Corporation of Japan; Nikon Corporation Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
6583980, Aug 18 2000 Applied Materials, Inc Substrate support tolerant to thermal expansion stresses
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D561206, Nov 25 2005 MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC Electrostatic chuck
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 22 2011Applied Materials, Inc.(assignment on the face of the patent)
Nov 30 2011AGARWAL, MONIKAApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0275870119 pdf
Dec 02 2011MARTIN, DANIELApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0275870119 pdf
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