FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is an enlarged view thereof taken along sections A—A and B—B in FIG. 1;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 4 with portions of the internal mechanism omitted; and,
FIG. 8 is a front perspective view thereof.
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
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