Patent
   D723077
Priority
Dec 03 2013
Filed
Dec 03 2013
Issued
Feb 24 2015
Expiry
Feb 24 2029
Assg.orig
Entity
unknown
20
20
n/a
The ornamental design for a chuck carrier film, as shown and described.

FIG. 1 is a top perspective view of a chuck carrier film.

FIG. 2 is a bottom perspective view of the chuck carrier film.

FIG. 3 is a top plan view of the chuck carrier film.

FIG. 4 is a back side view of the chuck carrier film.

FIG. 5 is a side view of the chuck carrier film, the opposite side view being a mirror image thereof; and,

FIG. 6 is a front side view of the chuck carrier film.

The broken lines in the figures form no part of the claimed design.

Sakata, Clinton

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Patent Priority Assignee Title
6837774, Mar 28 2001 Taiwan Semiconductor Manufacturing Co., Ltd Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
7025664, Mar 31 2000 Novellus Systems, Inc Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
8157615, Apr 12 2008 Device and process for applying and/or detaching a wafer to/from a carrier
20030119431,
20120168040,
20130306215,
D420022, May 08 1996 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
D420023, Nov 14 1997 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
D425919, Nov 14 1997 Applied Materials, Inc Electrostatic chuck with improved spacing mask and workpiece detection device
D489739, Dec 20 2002 NGK SPARK PLUG CO , LTD Electrostatic chuck
D490096, Dec 20 2002 NGK SPARK PLUG CO , LTD Electrostatic chuck
D490827, Dec 20 2002 NGK SPARK PLUG CO , LTD Electrostatic chuck
D497171, Dec 20 2002 NGK SPARK PLUG CO , LTD Electrostatic chuck
D546784, Sep 29 2005 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
D548705, Sep 29 2005 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
D561206, Nov 25 2005 MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC Electrostatic chuck
D587222, Aug 01 2006 Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD Attracting plate of an electrostatic chuck for semiconductor manufacturing
D609655, Oct 03 2008 NGK Insulators, Ltd. Electrostatic chuck
D687791, Mar 20 2012 Veeco Instruments INC Multi-keyed wafer carrier
D703162, Oct 17 2012 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 03 2013Applied Materials, Inc.(assignment on the face of the patent)
Dec 05 2013SAKATA, CLINTONApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0328020895 pdf
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