Patent
   D790489
Priority
Jul 08 2015
Filed
Jan 07 2016
Issued
Jun 27 2017
Expiry
Jun 27 2032
Assg.orig
Entity
unknown
12
29
n/a
The ornamental design for a vacuum contact pad, as shown and described.

FIG. 1 is a top perspective view of the first embodiment of a vacuum contact pad, showing our new design;

FIG. 2 is a top view thereof; the bottom view being identical;

FIG. 3 is a front view thereof; the rear, right and left views being identical;

FIG. 4 is an enlarged view of the area labeled 4 in FIG. 3 thereof;

FIG. 5 is a top perspective view of the second embodiment of a vacuum contact pad, showing our new design;

FIG. 6 is a top view thereof; the bottom view being identical;

FIG. 7 is a front view thereof; the rear, right and left views being identical; and,

FIG. 8 is an enlarged view of the area labeled 8 in FIG. 7 thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Miyazaki, Mitsuru, Toyomura, Naoki

Patent Priority Assignee Title
10568464, May 13 2014 DRYCAN SOLUTIONS 2015 LTD Bendable strainer
D800516, Nov 05 2015 DRYCAN SOLUTIONS 2015 LTD Can strainer
D816434, Sep 30 2016 Veggidome SPC Oval colander
D859331, Mar 31 2017 Ebara Corporation Vacuum contact pad
D868993, Aug 31 2017 HITACHI HIGH-TECH CORPORATION Electrode plate for a plasma processing apparatus
D870517, Oct 31 2018 Quintessential Products Pty. Ltd.; QUINTESSENTIAL PRODUCTS PTY LTD Tray
D873782, May 17 2016 Electro Scientific Industries, Inc Component carrier plate
D893438, Aug 21 2017 Tokyo Electron Limited Wafer boat
D988299, Jun 18 2021 Cellular module
D988300, Mar 09 2021 IoT module
ER7930,
ER8170,
Patent Priority Assignee Title
20040179323,
20040218339,
D246026, Feb 06 1976 Ball Corporation Storage bowl lettuce support or like article
D322011, Feb 21 1989 Lazy Susan tray
D397275, Jun 04 1997 William Garry, DuBay, Sr. Press for compressing and straining food products
D411516, Mar 15 1996 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
D494552, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D496008, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D548705, Sep 29 2005 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
D552565, Sep 08 2005 TOKYO OHKA KOGYO CO , LTD Supporting plate
D553104, Apr 21 2004 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
D609655, Oct 03 2008 NGK Insulators, Ltd. Electrostatic chuck
D616389, Oct 20 2008 Ebara Corporation Vacuum contact pad
D633347, Apr 24 2009 Popcorn sieve
D634585, Oct 26 2009 Koninklijke Philips Electronics N V Serving tray with LED light
D641216, Aug 12 2010 Dart Industries Inc Strainer insert for a container
D649126, Oct 20 2008 Ebara Corporation Vacuum contact pad
D650344, Oct 20 2008 Ebara Corporation Vacuum contact pad
D686582, Mar 20 2012 Veeco Instruments INC Wafer carrier having pockets
D708916, Mar 01 2013 149 IP HOLDING COMPANY LLC Splatter screen
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D723077, Dec 03 2013 Applied Materials, Inc Chuck carrier film
D731448, Oct 29 2013 Ebara Corporation Polishing pad for substrate polishing apparatus
D736993, Nov 18 2013 OLEDWORKS GMBH Illuminated OLED panel
JP1362649,
JP1362650,
JP1362932,
JP1504627,
JP1505947,
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 07 2016Ebara Corporation(assignment on the face of the patent)
Jan 14 2016TOYOMURA, NAOKIEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0376350510 pdf
Jan 18 2016MIYAZAKI, MITSURUEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0376350510 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule