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Patent
D859331
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Priority
Mar 31 2017
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Filed
Jul 19 2017
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Issued
Sep 10 2019
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Expiry
Sep 10 2034
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Assg.orig
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Entity
unknown
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6
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24
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n/a
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The ornamental design for a vacuum contact pad, as shown and described.
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FIG. 1 is a top plan view of a vacuum contact pad showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is an enlarged cross sectional view taken along line 7-7 in FIG. 1.
The broken line showing of the environment forms no part of the claimed design.
Yamamoto, Satoru, Nakanishi, Masayuki, Kodera, Kenji
Patent |
Priority |
Assignee |
Title |
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Electrostatic chuck |
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Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D633452, |
Aug 27 2009 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D649126, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D650344, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D716742, |
Sep 13 2013 |
ASM IP Holding B.V. |
Substrate supporter for semiconductor deposition apparatus |
D723077, |
Dec 03 2013 |
Applied Materials, Inc |
Chuck carrier film |
D769200, |
May 15 2013 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D790489, |
Jul 08 2015 |
Ebara Corporation |
Vacuum contact pad |
D825504, |
Apr 21 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D837755, |
Apr 16 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D839224, |
Dec 12 2016 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing |
JP1362932, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a