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Patent
D839224
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Priority
Dec 12 2016
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Filed
Jun 09 2017
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Issued
Jan 29 2019
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Expiry
Jan 29 2034
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Assg.orig
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Entity
unknown
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23
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32
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n/a
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The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
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FIG. 1 is a bottom perspective view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a top perspective view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross-sectional view taken along line 7-7 of FIG. 4; and,
FIG. 8 is an enlarged portion view labeled FIG. 8 in FIG. 7.
The dash-dot lines in FIG. 7 represent the boundary line of the enlarged portion view shown in FIG. 8.
Fukushima, Makoto, Nabeya, Osamu, Namiki, Keisuke, Togashi, Shingo, Yamaki, Satoru, Owada, Tomoko, Kishimoto, Masahiko
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a