Elastic membrane for semiconductor wafer polishing apparatus

Abstract

Description

FIG. 1 is a bottom plan view of a first elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is an enlarged perspective view of a portion taken along section 4 in FIG. 2;

FIG. 5 is a cross-sectional view taken along the line 5-5 in FIG. 2; and,

FIG. 6 is an enlarged portion view taken along line 6-6 in FIG. 5.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent boundary lines of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.