The ornamental design for an elasticmembrane for semiconductorwafer polishing apparatus, as shown and described.
FIG. 1 is a bottom plan view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is an enlarged perspective view of a portion taken along section 4 in FIG. 2;
FIG. 5 is a cross sectional view taken along line 5-5 in FIG. 2; and,
FIG. 6 is an enlarged portion view taken along line 6-6 in FIG. 5.
The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent the boundary lines of the claimed design.
All surfaces not shown form no part of the claimed design.