Patent
   D686582
Priority
Mar 20 2012
Filed
Mar 20 2012
Issued
Jul 23 2013
Expiry
Jul 23 2027
Assg.orig
Entity
unknown
39
37
n/a
The ornamental design for a wafer carrier having pockets, as shown and described.

FIG. 1 is a top perspective view of a wafer carrier having pockets showing our new design;

FIG. 2 is an enlarged view of a portion of FIG. 1;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom perspective view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is an enlarged view of a portion of FIG. 4; and,

FIG. 7 is a right side view thereof, the left side, front, and rear views being the same as the right side view.

The broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

The dash-dot broken lines define the area corresponding to the enlarged portion shown in FIGS. 2 and 6 and form no part of the claimed design.

Krishnan, Sandeep, Moy, Keng

Patent Priority Assignee Title
10197291, Jun 04 2015 TROPITONE FURNITURE CO., INC. Fire burner
D704155, Feb 18 2011 EPISTAR CORPORATION Wafer carrier
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D724553, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D730304, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D748593, Mar 05 2014 HZO, INC Boat for use in a material deposition apparatus
D760180, Feb 21 2014 HZO, INC Hexcell channel arrangement for use in a boat for a deposition apparatus
D764424, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D769200, May 15 2013 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D770990, May 15 2013 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D778247, Apr 16 2015 Veeco Instruments Inc.; VEECO INSTRUMENTS, INC Wafer carrier with a multi-pocket configuration
D778850, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778851, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D778852, May 15 2014 Kioxia Corporation Substrate for an electronic circuit
D784937, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D785576, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D786810, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D790489, Jul 08 2015 Ebara Corporation Vacuum contact pad
D791930, Jun 04 2015 TROPITONE FURNITURE CO , INC Fire burner
D793971, Mar 27 2015 Veeco Instruments INC Wafer carrier with a 14-pocket configuration
D793972, Mar 27 2015 Veeco Instruments INC Wafer carrier with a 31-pocket configuration
D806046, Apr 16 2015 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
D808349, May 15 2013 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D813180, May 15 2013 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D842450, Jun 04 2015 TROPITONE FURNITURE CO., INC. Fire burner
D852762, Mar 27 2015 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
D854506, Mar 26 2018 Veeco Instruments INC Chemical vapor deposition wafer carrier with thermal cover
D858469, Mar 26 2018 Veeco Instruments INC Chemical vapor deposition wafer carrier with thermal cover
D860146, Nov 30 2017 Veeco Instruments INC Wafer carrier with a 33-pocket configuration
D860147, Mar 26 2018 Veeco Instruments INC Chemical vapor deposition wafer carrier with thermal cover
D863239, Mar 26 2018 Veeco Instruments INC Chemical vapor deposition wafer carrier with thermal cover
D866491, Mar 26 2018 Veeco Instruments INC Chemical vapor deposition wafer carrier with thermal cover
D893438, Aug 21 2017 Tokyo Electron Limited Wafer boat
ER1219,
ER1922,
ER2449,
ER2608,
ER3761,
ER511,
Patent Priority Assignee Title
3731435,
3845738,
4165584, Jan 27 1977 ITT Corporation Apparatus for lapping or polishing materials
4512113, Sep 23 1982 Workpiece holder for polishing operation
4739589, Jul 12 1985 Siltronic AG Process and apparatus for abrasive machining of a wafer-like workpiece
5191738, Jun 16 1989 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
5193316, Oct 29 1991 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
5377451, Feb 23 1993 MEMC Electronic Materials, Inc. Wafer polishing apparatus and method
5422316, Mar 18 1994 MEMC Electronic Materials, Inc Semiconductor wafer polisher and method
5573448, Aug 18 1993 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
5647789, Nov 01 1993 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
5674107, Apr 25 1995 AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD Diamond polishing method and apparatus employing oxygen-emitting medium
5683518, Jan 21 1993 MOORE EPITAXIAL INC Rapid thermal processing apparatus for processing semiconductor wafers
5788777, Mar 06 1997 Northrop Grumman Systems Corporation Susceptor for an epitaxial growth factor
5840124, Jun 30 1997 EMCORE CORPORATION, A CORPORATION OF NEW JERSEY Wafer carrier with flexible wafer flat holder
5865666, Aug 20 1997 Bell Semiconductor, LLC Apparatus and method for polish removing a precise amount of material from a wafer
6080042, Oct 31 1997 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
6241825, Apr 16 1999 CuTek Research Inc. Compliant wafer chuck
6375749, Jul 14 1999 SEH America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
6454635, Aug 08 2000 SUNEDISON SEMICONDUCTOR LIMITED UEN201334164H Method and apparatus for a wafer carrier having an insert
6500059, Dec 01 2000 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
6514424, May 11 2000 Siltronic AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
6666948, Apr 23 2001 Silicon wafer polisher
6709981, Aug 16 2000 GLOBALWAFERS CO , LTD Method and apparatus for processing a semiconductor wafer using novel final polishing method
6733367, Apr 23 2001 Method and apparatus for polishing silicon wafers
7008308, May 20 2003 SUNEDISON SEMICONDUCTOR LIMITED UEN201334164H Wafer carrier
7169234, Jan 30 2004 ASM IP HOLDING B V Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
7235139, Oct 28 2003 Veeco Instruments INC Wafer carrier for growing GaN wafers
7252737, Aug 09 2001 Applied Materials, Inc. Pedestal with integral shield
8177993, Nov 05 2006 ALSEPHINA INNOVATIONS INC Apparatus and methods for cleaning and drying of wafers
8182315, Mar 24 2008 Chemical mechanical polishing pad and dresser
8328600, Mar 12 2010 Workpiece spindles supported floating abrasive platen
20020011204,
20030057089,
20090194026,
D633452, Aug 27 2009 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D674759, Aug 19 2010 EPISTAR CORPORATION Wafer carrier
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 20 2012Veeco Instruments Inc.(assignment on the face of the patent)
Apr 12 2012KRISHNAN, SANDEEPVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281220075 pdf
Apr 12 2012MOY, KENGVeeco Instruments INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281220075 pdf
Dec 16 2021Veeco Instruments INCHSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENTPATENT SECURITY AGREEMENT0585330321 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule