Chemical vapor deposition wafer carrier with thermal cover

Abstract

Description

FIG. 1 is a perspective view of a first embodiment of a chemical vapor deposition wafer carrier with thermal cover showing our new design.

FIG. 2 is a top plan view of the chemical vapor deposition wafer carrier with thermal cover of FIG. 1.

FIG. 3 is a right side view of the chemical vapor deposition wafer carrier with thermal cover of FIG. 1, with the left side view, front view, and rear view being identical.

FIG. 4 is a bottom plan view of the chemical vapor deposition wafer carrier with thermal cover of FIG. 1.

FIG. 5 is a perspective view of a second embodiment of a chemical vapor deposition wafer carrier with thermal cover, showing our new design, which differs from the first embodiment shown in FIGS. 1-4 in that it includes staples extending through the thickness of the chemical vapor deposition wafer carrier with thermal cover.

FIG. 6 is an exploded view of the chemical vapor deposition wafer carrier with thermal cover of FIG. 5.

FIG. 7 is a perspective view of a third embodiment of a chemical vapor deposition wafer carrier with thermal cover, which differs from the first embodiment shown in FIGS. 1-4 in that it does not include staples or apertures for staples in the radially outer portion of the chemical vapor deposition wafer carrier with thermal cover; and,

FIG. 8 is a bottom perspective view of the chemical vapor deposition wafer carrier with thermal cover of FIG. 7.

In each of the figures, portions or features shown in broken lines form no part of the claimed design.

Claims

The ornamental design for a chemical vapor deposition wafer carrier with thermal cover, as shown and described.