FIG. 1 is a perspective view of a first embodiment of a chemical vapor deposition wafer carrier with thermal cover showing our new design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a right side view thereof, with the left side view, front view, and rear view being identical.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a perspective view of a second embodiment of a chemical vapor deposition wafer carrier with thermal cover, showing our new design, which differs from the embodiment shown in FIG. 1 in that it includes staples extending through the thickness of the chemical vapor deposition wafer carrier with thermal cover; and,
FIG. 6 is a perspective view of the thermal cover of the chemical vapor deposition wafer carrier with thermal cover, shown separately from the base without staples for ease of illustration.
In each of the figures, portions or features shown in broken lines form no part of the claimed design.
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