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Patent
D981969
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Priority
Dec 18 2020
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Filed
Jun 15 2021
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Issued
Mar 28 2023
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Expiry
Mar 28 2038
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Assg.orig
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Entity
unknown
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0
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16
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n/a
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The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
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FIG. 1 is a top perspective view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a front view thereof, the rear view being identical;
FIG. 6 is a right-side view thereof, the left-side view being identical;
FIG. 7 is an enlarged cross-sectional end view taken along line 7-7 in FIG. 3 thereof; and,
FIG. 8 is an enlarged detail view of section 8 in FIG. 7 thereof.
Fukushima, Makoto, Nabeya, Osamu, Kato, Yuichi, Akazawa, Kenichi, Owada, Tomoko
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
10537975, |
Aug 18 2015 |
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6659850, |
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D633452, |
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D770990, |
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Elastic membrane for semiconductor wafer polishing apparatus |
D790041, |
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D808349, |
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D813180, |
May 15 2013 |
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D913977, |
Dec 12 2016 |
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D918161, |
Dec 19 2017 |
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TW167111, |
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TW197827, |
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TW215079, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a