Elastic membrane for semiconductor wafer polishing apparatus

Abstract

Description

FIG. 1 is a top perspective view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a front view thereof, the rear view being identical;

FIG. 6 is a right-side view thereof, the left-side view being identical;

FIG. 7 is an enlarged cross-sectional end view taken along line 7-7 in FIG. 3 thereof; and,

FIG. 8 is an enlarged detail view of section 8 in FIG. 7 thereof.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.