PTO Wrapper PDF
Dossier Espace Google
Patent
   D918161
Priority
Dec 19 2017
Filed
Jun 18 2018
Issued
May 04 2021
Expiry
May 04 2036

TERM.DISCL.
Inventors
Fukushima,…
Assg.orig
Ebara Corp…
Assg.curr
Ebara Corp…
Entity
unknown
Referenced by
1
References
22
Maint.:
n/a
The ornamental design for elastic membrane, as shown and described.

2.1 : Perspective

2.2 : Perspective

2.3 : Top

2.4 : Bottom

2.5 : Front

2.6 : Back

2.7 : Right

2.8 : Left

2.9 : Cross-sectional

2.10 : Enlarged

The parallel thin lines and radial thin lines in the representation represent contours only and do not illustrate ornamentation or decoration on the surfaces of the elastic membrane, which form no part of the claimed designs; the parts shown by means of broken lines in the reproductions are not part of the claimed designs; alternate long and short dash lines show only the boundary between the disclaimed part and the claimed part of the elastic membrane.
INVENTORS:

Fukushima, Makoto, Nabeya, Osamu, Kato, Yoshikazu, Namiki, Keisuke, Togashi, Shingo, Yamaki, Satoru, Owada, Tomoko

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D981969, Dec 18 2020 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
6659850, Mar 31 2000 Novellus Systems, Inc Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
7357699, Feb 10 2003 Ebara Corporation Substrate holding apparatus and polishing apparatus
7635292, Dec 10 2004 Ebara Corporation Substrate holding device and polishing apparatus
8469776, Nov 22 2006 Applied Materials, Inc. Flexible membrane for carrier head
8859070, Nov 30 2011 Ebara Corporation Elastic membrane
9573244, Mar 27 2014 Ebara Corporation Elastic membrane, substrate holding apparatus, and polishing apparatus
20130316628,
20180117730,
CN302949487,
CN304345271,
D633452, Aug 27 2009 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D769200, May 15 2013 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
D825505, Jun 18 2015 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D837755, Apr 16 2015 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D839224, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D859332, Jun 29 2017 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP1509492,
JP1509685,
JP1509686,
JP1521451,
JP1521701,
TW168373,
ASSIGNMENT RECORDS    Assignment records on the USPTO
////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 18 2018Ebara Corporation(assignment on the face of the patent)
Feb 19 2021TOGASHI, SHINGOEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Feb 22 2021NAMIKI, KEISUKEEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Feb 22 2021NABEYA, OSAMUEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Feb 22 2021YAMAKI, SATORUEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Feb 22 2021OWADA, TOMOKOEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Mar 10 2021FUKUSHIMA, MAKOTOEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
Mar 11 2021KATO, YOSHIKAZUEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0557470022 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule