FIG. 1 is a top perspective view of a sputtering target for a physical vapor deposition chamber, according to one embodiment of the novel design.
FIG. 2 is a bottom perspective view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a right side plan view thereof.
FIG. 6 is a left side plan view thereof.
FIG. 7 is a front view thereof.
FIG. 8 is a back view thereof.
FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 4.
FIG. 10 is a top perspective view of a sputtering target for a physical vapor deposition chamber, according to another embodiment of the novel design.
FIG. 11 is a bottom perspective view thereof.
FIG. 12 is a top plan view thereof.
FIG. 13 is a bottom plan view thereof.
FIG. 14 is a right side plan view thereof.
FIG. 15 is a left side plan view thereof.
FIG. 16 is a front view thereof.
FIG. 17 is a back view thereof; and,
FIG. 18 is an enlarged cross sectional view taken along line 18-18 in FIG. 13.
The broken lines show portions of a sputtering target for a physical vapor deposition chamber which form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
10442056, |
Jun 29 2012 |
Ebara Corporation |
Substrate holding apparatus and polishing apparatus |
10662520, |
Mar 29 2017 |
Applied Materials, Inc. |
Method for recycling substrate process components |
10811232, |
Aug 08 2017 |
Applied Materials, Inc |
Multi-plate faceplate for a processing chamber |
5320728, |
Mar 30 1990 |
Applied Materials, Inc. |
Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
6086725, |
Apr 02 1998 |
Applied Materials, Inc. |
Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
6114216, |
Nov 13 1996 |
Applied Materials, Inc |
Methods for shallow trench isolation |
6390905, |
Mar 31 2000 |
Novellus Systems, Inc |
Workpiece carrier with adjustable pressure zones and barriers |
6659850, |
Mar 31 2000 |
Novellus Systems, Inc |
Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
6815352, |
Nov 09 1999 |
Shin-Etsu Chemical Co., Ltd. |
Silicon focus ring and method for producing the same |
7402098, |
Oct 27 2006 |
Novellus Systems, Inc. |
Carrier head for workpiece planarization/polishing |
8371904, |
Aug 08 2008 |
CHARTERED SEMICONDUCTOR MANUFACTURING PTE LTD ; GLOBALFOUNDRIES SINGAPORE PTE LTD |
Polishing with enhanced uniformity |
8398833, |
Apr 14 2009 |
Honeywell International Inc |
Use of DC magnetron sputtering systems |
9475996, |
Oct 17 2012 |
|
Centrifugal fluid ring plasma reactor |
20040149567, |
|
|
|
20050152089, |
|
|
|
20050193952, |
|
|
|
20070076345, |
|
|
|
20080173541, |
|
|
|
20080308416, |
|
|
|
20090260982, |
|
|
|
20100096261, |
|
|
|
20100108500, |
|
|
|
20100170786, |
|
|
|
20120033340, |
|
|
|
20130316628, |
|
|
|
20140261180, |
|
|
|
20150170888, |
|
|
|
20150357169, |
|
|
|
20160002776, |
|
|
|
20160002788, |
|
|
|
20160035547, |
|
|
|
CN206573738, |
|
|
|
D351450, |
May 19 1993 |
RITEFLITE PTY LIMITED |
Target for shooting |
D363464, |
Aug 27 1992 |
Tokyo Electron Limited |
Electrode for a semiconductor processing apparatus |
D376744, |
Aug 03 1994 |
Gerd Eisenblatter GmbH |
Support plate |
D381030, |
Nov 21 1995 |
Applied Materials, Inc |
Sputtering target |
D411516, |
Mar 15 1996 |
Tokyo Electron Limited |
Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
D423026, |
Aug 20 1997 |
Tokyo Electron Limited |
Quartz cover |
D446231, |
Aug 21 2000 |
KOMATSU INDUSTRIES CORPORATION |
Nozzle for a plasma arc torch |
D487254, |
May 24 2002 |
Nichia Corporation |
Light emitting diode |
D496951, |
Jan 30 2003 |
Victor Equipment Company |
Mechanized cap for a plasma arc torch |
D503729, |
Oct 31 2003 |
Nordson Corporation |
Nozzle for dispensing adhesives and sealants |
D553104, |
Apr 21 2004 |
Tokyo Electron Limited |
Absorption board for an electric chuck used in semiconductor manufacture |
D557226, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D559066, |
Oct 26 2004 |
JSR Corporation |
Polishing pad |
D559993, |
Mar 30 2005 |
Tokyo Electron Limited |
Cover ring |
D559994, |
Mar 30 2005 |
Tokyo Electron Limited |
Cover ring |
D562856, |
Mar 30 2006 |
SULZER METCO US , INC |
Plasma gun anode |
D570310, |
Aug 01 2006 |
Tokyo Electron Limited |
Attracting plate of an electrostatic chuck for semiconductor manufacturing |
D571383, |
Jul 29 2005 |
Tokyo Electron Limited |
Top panel for microwave introduction window of a plasma processing apparatus |
D571831, |
Jul 29 2005 |
Tokyo Electron Limited |
Top panel for microwave introduction window of a plasma processing apparatus |
D571833, |
Jul 29 2005 |
Tokyo Electron Limited |
Top panel for microwave introduction window of plasma processing apparatus |
D572733, |
Jul 29 2005 |
Tokyo Electron Limited |
Top panel for microwave introduction window of a plasma processing apparatus |
D582949, |
Dec 15 2006 |
Tokyo Electron Limited |
Cover for a heater stage of a plasma processing apparatus |
D584591, |
Oct 26 2004 |
JSR Corporation |
Polishing pad |
D592029, |
Oct 26 2004 |
JSR Corporation |
Polishing pad |
D592030, |
Oct 26 2004 |
JSR Corporation |
Polishing pad |
D600660, |
Mar 28 2008 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D600989, |
Oct 26 2004 |
JSR Corporation |
Polishing pad |
D614593, |
Jul 21 2008 |
ASM KOREA LTD |
Substrate support for a semiconductor deposition apparatus |
D616389, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D616390, |
Mar 06 2009 |
Tokyo Electron Limited |
Quartz cover for manufacturing semiconductor wafers |
D633452, |
Aug 27 2009 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D649126, |
Oct 20 2008 |
Ebara Corporation |
Vacuum contact pad |
D669509, |
Oct 19 2011 |
Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts; KJELLBERG STIFTUNG, RECHTSFAHIGE STIFTUNG DES BURGERLICHEN RECHTS |
Nozzle for torch |
D678745, |
Jul 07 2011 |
|
Spinning insert polishing pad |
D683806, |
Jan 12 2012 |
SureFire, LLC |
Front plate for a firearm sound suppressor |
D687790, |
Mar 20 2012 |
Veeco Instruments INC |
Keyed wafer carrier |
D687791, |
Mar 20 2012 |
Veeco Instruments INC |
Multi-keyed wafer carrier |
D691974, |
Dec 22 2011 |
Tokyo Electron Limited |
Holding pad for transferring a wafer |
D694790, |
Sep 20 2011 |
Tokyo Electron Limited |
Baffle plate for manufacturing semiconductor |
D703162, |
Oct 17 2012 |
Sumitomo Electric Industries, Ltd. |
Wafer holder for stepper |
D716742, |
Sep 13 2013 |
ASM IP Holding B.V. |
Substrate supporter for semiconductor deposition apparatus |
D724553, |
Sep 13 2013 |
ASM IP Holding B.V. |
Substrate supporter for semiconductor deposition apparatus |
D732094, |
Jul 20 2012 |
Ivoclar Vivadent AG |
Firing plate for a dental furnace |
D732145, |
Feb 04 2014 |
ASM IP Holding B.V. |
Shower plate |
D733843, |
Feb 04 2014 |
ASM IP Holding, B.V. |
Shower plate |
D741823, |
Jul 10 2013 |
KOKUSAI ELECTRIC CORPORATION |
Vaporizer for substrate processing apparatus |
D741921, |
Apr 15 2014 |
Q-LINEA AB |
Positive mold for manufacturing a sample holding disc |
D750728, |
Dec 02 2014 |
|
Laser target |
D767234, |
Mar 02 2015 |
MORGAN STANLEY SENIOR FUNDING, INC |
Wafer support ring |
D769200, |
May 15 2013 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D770992, |
Jun 12 2015 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D790039, |
Apr 08 2016 |
Applied Materials, Inc |
Showerhead for a semiconductor processing chamber |
D790041, |
Jan 08 2016 |
ASM IP Holding B.V. |
Gas dispersing plate for semiconductor manufacturing apparatus |
D793572, |
Jun 10 2015 |
Tokyo Electron Limited |
Electrode plate for plasma processing apparatus |
D794753, |
Apr 08 2016 |
Applied Materials, Inc |
Showerhead for a semiconductor processing chamber |
D795208, |
Aug 18 2015 |
Tokyo Electron Limited |
Electrostatic chuck for semiconductor manufacturing equipment |
D796458, |
Jan 08 2016 |
ASM IP Holding B.V. |
Gas flow control plate for semiconductor manufacturing apparatus |
D797067, |
Apr 21 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D797691, |
Apr 14 2016 |
Applied Materials, Inc |
Composite edge ring |
D798248, |
Jun 18 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D801942, |
Apr 16 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D808349, |
May 15 2013 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus |
D810705, |
Apr 01 2016 |
VEECO INSTRUMENTS, INC |
Self-centering wafer carrier for chemical vapor deposition |
D813181, |
Jul 26 2016 |
KOKUSAI ELECTRIC CORPORATION |
Cover of seal cap for reaction chamber of semiconductor |
D825504, |
Apr 21 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D825505, |
Jun 18 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D830435, |
Dec 28 2015 |
NTN Corporation |
Inner ring for tapered roller bearing |
D830981, |
Apr 07 2017 |
ASM IP HOLDING B V ; ASM IP Holding B.V. |
Susceptor for semiconductor substrate processing apparatus |
D836572, |
Sep 30 2016 |
Applied Materials, Inc.; Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D837755, |
Apr 16 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D839224, |
Dec 12 2016 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing |
D846514, |
May 03 2018 |
KOKUSAI ELECTRIC CORPORATION |
Boat of substrate processing apparatus |
D851613, |
Oct 05 2017 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D868124, |
Dec 11 2017 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D869409, |
Sep 30 2016 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D877101, |
Mar 09 2018 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D888903, |
Dec 17 2018 |
Applied Materials, Inc |
Deposition ring for physical vapor deposition chamber |
D891382, |
Feb 08 2019 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D893441, |
Jun 28 2019 |
Applied Materials, Inc |
Base plate for a processing chamber substrate support |
D894137, |
Oct 05 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
JP1420846, |
|
|
|
JP1421157, |
|
|
|
JP1422692, |
|
|
|
TW146490, |
|
|
|
TW223429, |
|
|
|
TW223430, |
|
|
|